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MC145425P

NXP Semiconductors

MC145425P by NXP Semiconductors

MC145425P by NXP Semiconductors is a CMOS ISDN CONTROLLER with 24 terminals, operating at 5V. It offers 0.16 Mbps data rate, BASIC ISDN access rate, and 85°C max temp. Ideal for digital transmission interfaces in industrial applications.

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Digiode

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Vyrian

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Mil-Aero Solutions, Inc.

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Anansix

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Speed Components Ltd

Israel . 726 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 345 parts In-Stock

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LWI Electronics Inc

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Nova Conductors

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Bristol Electronics

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Atlantic Semiconductor

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Prism Electronics

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Corel Iberica Componentes, S.L.

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One Stop Electronics

USA . 1,767 parts In-Stock

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Ampacity Inc.

Singapore . 321 parts In-Stock

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Overview

Transform the way you connect with the MC145425P by NXP Semiconductors. Designed for seamless digital transmission interfaces, this ISDN controller offers unparalleled reliability and performance. With a focus on quality and innovation, NXP Semiconductors delivers cutting-edge technology that empowers your communication needs. Whether you're looking to enhance your networking capabilities or streamline data transmission, the MC145425P provides unmatched value and benefits. Upgrade your systems today and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for easy installation and long-term use.

Power Supplies (V): 5

Operating at a standard voltage of 5V ensures compatibility with most power sources, making it easy to integrate into existing systems.

ISDN Access Rate: BASIC

Supporting basic ISDN access rate ensures reliable data transmission over traditional telephone lines, making it suitable for various applications.

No. of Terminals: 24

With 24 terminals, the product offers flexibility in connectivity options, allowing for multiple connections and configurations.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures the product can withstand heat and operate efficiently in various environments.

Minimum Output High Voltage: 2.5 V

The minimum output high voltage of 2.5V ensures reliable signal transmission and compatibility with other devices in the network.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the product to function in cold environments without any performance issues.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and signal integrity.

Technology: CMOS

Utilizing CMOS technology, the product offers low power consumption and high performance, making it energy-efficient and cost-effective.

Maximum Output Low Voltage: 0.8 V

The maximum output low voltage of 0.8V ensures compatibility with various devices and prevents signal distortion during data transmission.

Technical Specifications

Digital Transmission Interfaces MC145425P attributes and parameters. Explore more Digital Transmission Interfaces devices from NXP Semiconductors

Specs

Data Rate:

.16 Mbps

ISDN Access Rate:

BASIC

JESD-30 Code:

R-PDIP-T24

JESD-609 Code:

e0

Length:

31.75 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Output High Voltage:

2.5 V

Maximum Output Low Current:

3.5 Amp

Maximum Output Low Voltage:

.8 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Reference Point:

S/T

Maximum Seated Height:

5.08 mm

Sub-Category:

Digital Transmission Interfaces

Maximum Supply Current:

15 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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