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TCM2203J-00

Texas Instruments

TCM2203J-00 by Texas Instruments

Texas Instruments TCM2203J-00 is a PCM transceiver with 28 terminals, operating at 0-70°C. It has a supply voltage of 5V and max current of 40mA. Ideal for digital transmission interfaces in commercial-grade applications due to its ceramic package and through-hole terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,539 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,539

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-

-

-

Digiode

USA . 1,533 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,533

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,333 parts In-Stock

1+ parts

$8.622

100+ parts

-

1k+ parts

$9.291

10k+ parts

-

2,333

$8.622

-

$9.291

-

DigiPath Technology Company

USA . 352 parts In-Stock

1+ parts

$9.494

100+ parts

-

1k+ parts

-

10k+ parts

-

352

$9.494

-

-

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ChromeModa Solutions

Germany . 4,625 parts In-Stock

1+ parts

$9.688

100+ parts

$7.944

1k+ parts

-

10k+ parts

-

4,625

$9.688

$7.944

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IDEA Electronic Components Group

UK . 1,757 parts In-Stock

1+ parts

$9.688

100+ parts

$9.204

1k+ parts

$8.719

10k+ parts

-

1,757

$9.688

$9.204

$8.719

-

AZTECH Wire

Italy . 699 parts In-Stock

1+ parts

$14.650

100+ parts

-

1k+ parts

-

10k+ parts

-

699

$14.650

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-

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One Stop Electronics

USA . 442 parts In-Stock

1+ parts

$744.000

100+ parts

-

1k+ parts

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10k+ parts

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442

$744.000

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Corphita

USA . 2,154 parts In-Stock

1+ parts

-

100+ parts

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2,154

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Overview

Unlock seamless digital transmission with the TCM2203J-00 by Texas Instruments. Crafted with precision and quality, this PCM transceiver offers unmatched reliability and performance in a compact rectangular package. Whether you're working on telecommunications, industrial control systems, or data communication applications, this innovative device delivers exceptional value, efficiency, and functionality. Trust Texas Instruments to provide cutting-edge solutions that exceed your expectations. Experience the difference with the TCM2203J-00 today.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed material provides durability and protection, making this product ideal for long-term use in various environments.

No. of Terminals: 28

Having 28 terminals allows for versatility in connections and configurations, making it suitable for a range of applications.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, this product can perform reliably even in demanding conditions.

Nominal Supply Voltage: 5 V

The 5V supply voltage ensures stable operation and compatibility with standard power sources, making integration easier.

Technical Specifications

Digital Transmission Interfaces TCM2203J-00 attributes and parameters. Explore more Digital Transmission Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

R-GDIP-T28

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.7 mm

Maximum Supply Current:

40 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

TCM2203J-00 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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