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TEA7868DP

STMicroelectronics

TEA7868DP by STMicroelectronics

TEA7868DP by STMicroelectronics is a Digital Transmission Interface with 16V power supply, operating b/w -25 °C to 65°C. It features 8 terminals in an IN-LINE package style, suitable for applications requiring bipolar technology and a nominal voltage of 16V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,297 parts In-Stock

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4,297

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Digiode

USA . 1,861 parts In-Stock

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1,861

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SPM Sales

USA . 1,500 parts In-Stock

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1,500

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Anansix

USA . 1,476 parts In-Stock

1+ parts

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1,476

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Odi Ramu Company

Canada . 154 parts In-Stock

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154

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PC Components Company LLC

USA . 100 parts In-Stock

1+ parts

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100

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Bristol Electronics

USA . 100 parts In-Stock

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100

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ComSIT Distribution GmbH

Germany . 100 parts In-Stock

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,328 parts In-Stock

1+ parts

$12.517

100+ parts

-

1k+ parts

$11.265

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1,328

$12.517

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$11.265

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MKK Technologies

India . 1,728 parts In-Stock

1+ parts

$23.537

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1,728

$23.537

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DigiPath Technology Company

USA . 1,728 parts In-Stock

1+ parts

$23.537

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1,728

$23.537

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Corphita

USA . 987 parts In-Stock

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987

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Parana Technologies

USA . 319 parts In-Stock

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$14.966

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319

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$14.966

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Kepictronics

USA . 300 parts In-Stock

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300

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Assy Fe

Spain . 245 parts In-Stock

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245

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Overview

Experience seamless digital transmission with the TEA7868DP by STMicroelectronics. Crafted with precision and expertise, this product offers unrivaled quality and reliability. Designed for a variety of applications in industries such as telecommunications and automotive, the TEA7868DP provides exceptional value by ensuring optimal performance and efficiency. Elevate your projects with the advantages and benefits that only STMicroelectronics can deliver. Trust in the TEA7868DP to exceed your expectations and take your innovations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Package Shape: RECTANGULAR

Rectangular package shape allows for easier mounting and integration into existing systems.

Power Supplies (V): 16

The 16V power supply ensures compatibility with a wide range of systems and applications.

No. of Terminals: 8

Having 8 terminals provides flexibility in connectivity options and allows for multiple signal inputs/outputs.

Package Style (Meter): IN-LINE

The in-line package style is space-saving and easy to install in limited spaces or in a series with other components.

Maximum Operating Temperature: 65 °C

With a maximum operating temperature of 65 °C, the product can withstand high temperature environments without compromising performance.

Minimum Operating Temperature: -25 °C

The product's minimum operating temperature of -25 °C ensures reliable operation even in cold environments.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish provides good conductivity and solderability for secure and stable connections.

Terminal Position: DUAL

Dual terminal position allows for easy and secure mounting on a circuit board or in a system.

Technology: BIPOLAR

Bipolar technology offers reliable signal transmission and compatibility with a wide range of devices and systems.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides strong mechanical support and stability for the product, especially in high-vibration environments.

Nominal Supply Voltage: 16 V

Having a nominal supply voltage of 16V ensures consistent and reliable operation across various applications and power sources.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch allows for easy connection to standard PCB layouts and components, simplifying installation and maintenance.

Technical Specifications

Digital Transmission Interfaces TEA7868DP attributes and parameters. Explore more Digital Transmission Interfaces devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e0

No. of Terminals:

8

Maximum Operating Temperature:

65 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

16

Qualification:

Not Qualified

Sub-Category:

Digital Transmission Interfaces

Nominal Supply Voltage:

16 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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