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STLC3075

STMicroelectronics

STLC3075 by STMicroelectronics

STLC3075 by STMicroelectronics is a digital SLIC designed for telecom applications, featuring a low-profile flatpack package and operating temp range of -40 °C to 85 °C. It supports power supplies from 4.5V to 12V with a PSRR of 26 dB. This device ensures reliable performance in industrial environments with its nickel palladium gold terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,874 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,874

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Vyrian

USA . 2,503 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,503

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Anansix

USA . 1,390 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,390

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,753 parts In-Stock

1+ parts

$11.091

100+ parts

-

1k+ parts

$9.982

10k+ parts

-

1,753

$11.091

-

$9.982

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MKK Technologies

India . 749 parts In-Stock

1+ parts

$20.855

100+ parts

-

1k+ parts

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10k+ parts

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749

$20.855

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DigiPath Technology Company

USA . 749 parts In-Stock

1+ parts

$20.855

100+ parts

-

1k+ parts

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10k+ parts

-

749

$20.855

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Corphita

USA . 1,540 parts In-Stock

1+ parts

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1,540

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Parana Technologies

USA . 23 parts In-Stock

1+ parts

-

100+ parts

$13.260

1k+ parts

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23

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$13.260

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Overview

Experience unmatched reliability and performance with the STLC3075 from STMicroelectronics, a leader in innovative digital transmission solutions. Designed for industrial applications, this robust interface ensures seamless connectivity across various environments, delivering superior power efficiency and temperature resilience. With its low-profile, surface-mount design, the STLC3075 is perfect for compact systems, enhancing your products with quality you can trust. Elevate your designs and achieve excellence with STMicroelectronics today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliable performance in various environments, making it a robust choice for digital transmission applications.

Surface Mount: YES

Surface mount capability allows for easier and more efficient PCB design and assembly, reducing manufacturing costs.

Package Shape: SQUARE

The square package shape optimizes the layout for compact designs, maximizing space utilization in electronic devices.

Power Supplies (V): 4.5/12

Supports a versatile range of power supply voltages, enhancing compatibility with various systems and applications.

No. of Terminals: 44

With 44 terminals, this product accommodates a wide array of connections, facilitating complex functionalities in digital interfaces.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design is ideal for applications with height restrictions, allowing for slim device designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable operation in demanding environments, enhancing durability and longevity.

Minimum Operating Temperature: -40 °C

Operational down to -40 °C makes this product suitable for extreme conditions, expanding its application range in harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections over time.

Terminal Position: QUAD

Quad terminal positioning allows for flexible layout options on PCBs, enabling better design flexibility and integration.

Maximum Seated Height: 1.6 mm

A low maximum seated height facilitates compact assembly, ideal for space-constrained applications.

Width: 10 mm

The 10 mm width allows for effective placement on standard PCBs, maintaining compatibility with existing designs.

Minimum Power Supply Rejection Ratio (PSRR): 26 dB

A PSRR of 26 dB facilitates better noise rejection, ensuring cleaner signal transmission and overall improved performance.

Battery Feed: CONSTANT CURRENT

Constant current battery feeding ensures consistent performance and efficiency, extending battery life during operation.

Length: 10 mm

Maintaining a 10 mm length allows for standardized placement and effective use of space in device designs.

Temperature Grade: INDUSTRIAL

Rated for industrial use, this product is built to handle rigorous conditions, making it a reliable choice for critical applications.

Technology: BCDMOS

Utilizing BCDMOS technology enhances integration of analog and digital functions, providing better overall performance.

Terminal Form: GULL WING

Gull wing terminals provide excellent surface mount soldering characteristics, ensuring strong mechanical and electrical connections.

Maximum Supply Current: 0.09 mA

Low maximum supply current maximizes energy efficiency, making it suitable for battery-powered applications.

Telecom IC Type: DIGITAL SLIC

As a digital SLIC, it is optimized for telecommunication applications, ensuring high-quality signal processing and management.

Nominal Supply Voltage: 6 V

A nominal supply voltage of 6 V is ideal for a wide range of electronic applications, enhancing design flexibility.

Hybrid 2-4 CONVERSION: YES

Supports hybrid 2-4 conversion, which is crucial for efficient transmission in telecommunication systems.

Terminal Pitch: 0.8 mm

0.8 mm terminal pitch allows for high-density integration on PCBs, making it suitable for compact electronic designs.

Technical Specifications

Digital Transmission Interfaces STLC3075 attributes and parameters. Explore more Digital Transmission Interfaces devices from STMicroelectronics

Specs

Battery Feed:

CONSTANT CURRENT

Hybrid:

2-4 CONVERSION

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e4

Length:

10 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Power Supply Rejection Ratio (PSRR):

26 dB

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

4.5/12

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Analog Transmission Interfaces

Maximum Supply Current:

.09 mA

Nominal Supply Voltage:

6 V

Surface Mount:

YES

Technology:

BCDMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

STLC3075 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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