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STLC3055QTR

STMicroelectronics

STLC3055QTR by STMicroelectronics

STLC3055QTR by STMicroelectronics is a digital transmission interface with 44 terminals in a square package. It operates b/w -40 to 85 °C, with power supplies of 5.5/14.5 V and PSRR of 26 dB. Ideal for telecom applications as a DIGITAL SLIC hybrid with constant current battery feed.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,314 parts In-Stock

1+ parts

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7,314

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Digiode

USA . 1,464 parts In-Stock

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1,464

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Anansix

USA . 1,107 parts In-Stock

1+ parts

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1,107

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 507 parts In-Stock

1+ parts

$9.917

100+ parts

-

1k+ parts

$8.925

10k+ parts

-

507

$9.917

-

$8.925

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MKK Technologies

India . 895 parts In-Stock

1+ parts

$18.648

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895

$18.648

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DigiPath Technology Company

USA . 895 parts In-Stock

1+ parts

$18.648

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895

$18.648

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AZTECH Wire

Italy . 785 parts In-Stock

1+ parts

$19.040

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785

$19.040

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Microchip USA

USA . 170 parts In-Stock

1+ parts

$23.912

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170

$23.912

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Component Stockers USA

USA . 591 parts In-Stock

1+ parts

$99.990

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591

$99.990

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GreenTree Electronics

Israel . 4,300 parts In-Stock

1+ parts

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4,300

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Parana Technologies

USA . 1,795 parts In-Stock

1+ parts

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100+ parts

$11.857

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1,795

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$11.857

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Vigor

Singapore . 1,612 parts In-Stock

1+ parts

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1,612

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Corphita

USA . 1,477 parts In-Stock

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1,477

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Overview

Upgrade your digital transmission interfaces with the STLC3055QTR from STMicroelectronics, a leading manufacturer known for its high-quality components. Designed for industrial applications, this versatile telecom IC offers constant current battery feed and impressive power supply rejection ratio for stable performance. With a compact flatpack, low profile package style and quad terminal position, this device delivers reliable connectivity in a wide range of environments. Trust STMicroelectronics to provide cutting-edge technology that meets your needs for seamless data transmission. Elevate your systems with the STLC3055QTR today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides good durability and protection for the internal components of the product.

Surface Mount: YES

Being surface mountable makes it easy to integrate this product onto circuit boards, allowing for efficient and compact design.

Power Supplies (V): 5.5/14.5

This product has a flexible voltage range, making it compatible with a variety of power supply options.

No. of Terminals: 44

The high number of terminals allows for a wide range of connections and functionalities within the product.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent conductivity and corrosion resistance for reliable performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures proper functionality even in cold environments.

Technology: BCDMOS

The use of BCDMOS technology allows for high integration of analog and digital functions, leading to enhanced performance.

Nominal Supply Voltage: 6 V

The nominal supply voltage of 6V provides a stable power source for consistent operation of the product.

Technical Specifications

Digital Transmission Interfaces STLC3055QTR attributes and parameters. Explore more Digital Transmission Interfaces devices from STMicroelectronics

Specs

Battery Feed:

CONSTANT CURRENT

Hybrid:

2-4 CONVERSION

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e4

Length:

10 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Power Supply Rejection Ratio (PSRR):

26 dB

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

5.5/14.5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Analog Transmission Interfaces

Maximum Supply Current:

.14 mA

Nominal Supply Voltage:

6 V

Surface Mount:

YES

Technology:

BCDMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

STLC3055QTR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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