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STLC3055N

STMicroelectronics

STLC3055N by STMicroelectronics

STLC3055N by STMicroelectronics is a digital SLIC designed for telecom applications, featuring a low-profile flatpack package and operating temp range of -40 °C to 85 °C. It supports power supplies of 5.5V-12V with a PSRR of 26 dB. This IC ensures reliable performance in industrial environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,489 parts In-Stock

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4,489

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Digiode

USA . 3,135 parts In-Stock

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3,135

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Anansix

USA . 1,958 parts In-Stock

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1,958

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Ack Elektronik San.Tic.Ltd.Sti

. 22 parts In-Stock

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22

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,178 parts In-Stock

1+ parts

$6.867

100+ parts

-

1k+ parts

$6.180

10k+ parts

-

1,178

$6.867

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$6.180

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MKK Technologies

India . 1,015 parts In-Stock

1+ parts

$12.913

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-

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1,015

$12.913

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DigiPath Technology Company

USA . 1,015 parts In-Stock

1+ parts

$12.913

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1,015

$12.913

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Futuretech Components

Singapore . 10,000 parts In-Stock

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10,000

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A-Z Elektronik GmbH

Germany . 5,174 parts In-Stock

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5,174

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Kepictronics

USA . 4,350 parts In-Stock

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4,350

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Corphita

USA . 2,219 parts In-Stock

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2,219

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Parana Technologies

USA . 739 parts In-Stock

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$8.210

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739

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$8.210

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Perfect Parts

USA . 11 parts In-Stock

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Overview

Unlock unparalleled performance with the STLC3055N from STMicroelectronics, a leader in innovative digital transmission solutions. Designed for reliability under challenging conditions, this robust interface excels in telecommunications and industrial applications. Its low-profile design and exceptional power efficiency ensure seamless integration into your systems. Experience the quality and expertise of STMicroelectronics, delivering unmatched value that propels your projects to success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material enhances protection against environmental factors, increasing the product's longevity and reliability.

Surface Mount: YES

Surface mount technology allows for more efficient use of PCB space, enabling smaller designs and facilitating automated assembly.

Package Shape: SQUARE

The square shape provides a uniform footprint, allowing for easier integration into various circuit layouts.

Power Supplies (V): 5.5/12

Wide voltage supply range ensures compatibility with various electrical systems, enhancing design flexibility.

No. of Terminals: 44

A high number of terminals allows for significant connectivity options, supporting complex functionalities and minimizing the need for additional components.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design is ideal for space-constrained applications, enabling compact equipment designs.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in demanding environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature extends the product's usability in harsh conditions, enhancing its versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

Premium plating materials provide excellent corrosion resistance and conductivity, ensuring reliable electrical connections.

Terminal Position: QUAD

Quad terminal positioning supports efficient layout and arrangement on PCBs, simplifying design processes.

Maximum Seated Height: 1.6 mm

Low seated height allows for a compact design, aiding in reducing overall system profiles.

Width: 10 mm

Standard width facilitates easy integration into various circuit designs without requiring custom layouts.

Minimum Power Supply Rejection Ratio (PSRR): 26 dB

A minimum PSRR of 26 dB helps to maintain stable operation by minimizing the effect of supply voltage fluctuations on circuit performance.

Battery Feed: CONSTANT CURRENT

Constant current design improves power efficiency and reduces the risk of damage to sensitive components.

Length: 10 mm

Standard length aids in compatibility with existing designs and helps ensure easier replacement and upgrades.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature range, making it suitable for applications in harsh conditions, reinforcing product reliability.

Technology: BCDMOS

BCD (Bipolar-CMOS-DMOS) technology provides enhanced performance for digital and power applications, ensuring efficient operation.

Terminal Form: GULL WING

Gull wing terminals are known for their ease of handling and soldering, which simplifies the manufacturing process.

Maximum Supply Current: 0.09 mA

Low supply current requirement enhances energy efficiency, making it ideal for battery-powered devices.

Telecom IC Type: DIGITAL SLIC

Designed specifically as a digital subscriber line interface, this IC is optimized for telecom applications, ensuring reliable connectivity.

Nominal Supply Voltage: 6 V

6 V nominal supply voltage aligns with common standards, facilitating compatibility in various electronic circuits.

Hybrid 2-4 CONVERSION

Supports hybrid conversion features that enhance the flexibility and functionality in telecom applications.

Terminal Pitch: 0.8 mm

0.8 mm pitch allows for denser layouts on the PCB while maintaining manageable soldering and assembly processes.

Technical Specifications

Digital Transmission Interfaces STLC3055N attributes and parameters. Explore more Digital Transmission Interfaces devices from STMicroelectronics

Specs

Battery Feed:

CONSTANT CURRENT

Hybrid:

2-4 CONVERSION

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e4

Length:

10 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Power Supply Rejection Ratio (PSRR):

26 dB

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

5.5/12

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Analog Transmission Interfaces

Maximum Supply Current:

.09 mA

Nominal Supply Voltage:

6 V

Surface Mount:

YES

Technology:

BCDMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

STLC3055N Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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