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STLC5411FN

STMicroelectronics

STLC5411FN by STMicroelectronics

STLC5411FN by STMicroelectronics is a digital transmission interface chip with 44 terminals, operating at 5V. It supports ISDN basic access rate at 0.16 Mbps and features CMOS technology. Ideal for telecom applications requiring a commercial-grade solution with ANSI T1.601 standard compliance.

Median Price

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Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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ComSIT Distribution GmbH

Germany . 19,938 parts In-Stock

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Vyrian

USA . 4,859 parts In-Stock

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Anansix

USA . 2,120 parts In-Stock

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Digiode

USA . 1,661 parts In-Stock

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LWI Electronics Inc

India . 868 parts In-Stock

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Digital Electronic Gebert Verwaltungs UG

Germany . 488 parts In-Stock

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Q Components

USA . 18 parts In-Stock

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ABC Electronics Ltd.

UK . 15 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 11 parts In-Stock

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IDEA Electronic Components Group

UK . 1,214 parts In-Stock

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$14.281

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$12.853

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$12.853

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MKK Technologies

India . 1,341 parts In-Stock

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$26.855

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$26.855

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DigiPath Technology Company

USA . 1,341 parts In-Stock

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$26.855

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GreenTree Electronics

Israel . 50,000 parts In-Stock

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Kepictronics

USA . 8,234 parts In-Stock

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Metaverse IC Inc.

Canada . 5,981 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,889 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Corphita

USA . 813 parts In-Stock

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Parana Technologies

USA . 671 parts In-Stock

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$17.075

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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Overview

Enhance your digital transmission interfaces with the STLC5411FN by STMicroelectronics. This high-quality telecom IC offers basic ISDN access rates and a range of 44 terminals for seamless connectivity. With a maximum operating temperature of 70 °C and a commercial grade technology, this chip carrier package is perfect for various applications. Experience the value of reliable performance and efficiency with the STLC5411FN, providing customers with top-notch quality and advanced features to elevate their systems to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to heat, making the product long-lasting and reliable.

Surface Mount: YES

This feature allows for easy and convenient installation on circuit boards, saving time and effort during setup.

Power Supplies (V): 5

The 5V power supply ensures compatibility with standard power sources, making the product versatile and easy to use.

No. of Terminals: 44

The high number of terminals allows for connectivity with multiple devices, making the product suitable for complex networking applications.

Maximum Operating Temperature: 70 °C

The high operating temperature range ensures reliable performance even in extreme conditions, increasing the product's usability and reliability.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable for data transmission.

Data Rate: 0.16 Mbps

The 0.16 Mbps data rate allows for fast and efficient data transmission, making the product suitable for high-speed communication applications.

Technical Specifications

Digital Transmission Interfaces STLC5411FN attributes and parameters. Explore more Digital Transmission Interfaces devices from STMicroelectronics

Specs

Data Rate:

.16 Mbps

ISDN Access Rate:

BASIC

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e0

Length:

16.5862 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Output High Voltage:

2.4 V

Maximum Output Low Current:

7 Amp

Maximum Output Low Voltage:

.4 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Reference Point:

U

Maximum Seated Height:

4.57 mm

Standard:

ANSI T1.601

Sub-Category:

Digital Transmission Interfaces

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

16.5862 mm

Trade Compliance

STLC5411FN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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