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MTC-30132SO-C

Onsemi

MTC-30132SO-C by Onsemi

MTC-30132SO-C by Onsemi is a small outline digital transmission interface with 28 terminals. Its GULL WING terminal form and 1.27mm pitch make it suitable for telecom applications as a DIGITAL SLIC IC, measuring 7.5mm in width and 17.9mm in length with a max seated height of 2.65mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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LIBRA Elektronik GmbH

Germany . 7,000 parts In-Stock

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7,000

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Digiode

USA . 2,286 parts In-Stock

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2,286

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Bristol Electronics

USA . 1,400 parts In-Stock

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1,400

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ComSIT Distribution GmbH

Germany . 1,400 parts In-Stock

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1,400

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Dan-Mar Components

USA . 1,400 parts In-Stock

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1,400

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Vyrian

USA . 512 parts In-Stock

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512

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Kepictronics

USA . 5,975 parts In-Stock

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5,975

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SupplyDigital Components

Austria . 3,397 parts In-Stock

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3,397

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Corphita

USA . 1,634 parts In-Stock

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1,634

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TANS Electronics

Latvia . 545 parts In-Stock

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545

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UHIMA Technologies

Türkiye . 540 parts In-Stock

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540

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Corohmni

South Africa . 495 parts In-Stock

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495

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Problanco Electronics

Mexico . 377 parts In-Stock

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377

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Kulean Microsystems

USA . 17 parts In-Stock

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17

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Overview

Experience seamless digital transmission with the MTC-30132SO-C by Onsemi, a leading manufacturer known for its top-quality products. This innovative device falls under the category of Digital Transmission Interfaces, offering unparalleled performance and reliability. Ideal for telecom applications, this small outline package is designed to deliver exceptional results with its dual terminal position and gull wing terminal form. Trust Onsemi to provide you with cutting-edge solutions that will elevate your communication systems to new heights. Choose the MTC-30132SO-C for unmatched value, benefits, and advantages that will exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and resistance to external elements, ensuring a long lifespan for the product.

Surface Mount: YES

Being surface mount compatible allows for easy and efficient installation on circuit boards, making integration into electronic devices seamless.

No. of Terminals: 28

Having a high number of terminals enables versatile connectivity options, accommodating various signal inputs and outputs for comprehensive digital transmission.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on PCBs, making it ideal for compact electronic devices where size constraints are a concern.

Maximum Seated Height: 2.65 mm

The low seated height allows for a slim profile, contributing to the overall sleek design of the product and making it suitable for thin electronic applications.

Width: 7.5 mm

The narrow width of the product facilitates efficient use of space on circuit boards, promoting compact designs in electronic devices.

Length: 17.9 mm

The moderate length provides ample room for the arrangement of terminals and components, ensuring optimal functionality and performance of the digital transmission interface.

Terminal Form: GULL WING

The gull wing terminal form offers strong mechanical support and facilitates easy soldering during assembly, enhancing the overall reliability and durability of the product.

Telecom IC Type: DIGITAL SLIC

The integration of a digital SLIC (subscriber line interface circuit) ensures efficient signal processing and transmission, making the product well-suited for telecom applications that require high-quality digital communication.

Terminal Pitch: 1.27 mm

The fine terminal pitch allows for precise connection and reliable signal transmission, maintaining signal integrity in digital interfaces for optimal performance.

Technical Specifications

Digital Transmission Interfaces MTC-30132SO-C attributes and parameters. Explore more Digital Transmission Interfaces devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G28

Length:

17.9 mm

No. of Terminals:

28

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

MTC-30132SO-C Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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