Loading...

MTC-30132SO-I

Onsemi

MTC-30132SO-I by Onsemi

MTC-30132SO-I by Onsemi is a small outline digital transmission interface IC with 28 terminals in a rectangular package. It features gull wing terminal form, 1.27mm pitch, and dual terminal position. Ideal for telecom applications requiring compact design and surface mount compatibility.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 569 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

569

-

-

-

-

Vyrian

USA . 174 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

174

-

-

-

-

Bristol Electronics

USA . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 8,185 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,185

-

-

-

-

SupplyDigital Components

Austria . 3,994 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,994

-

-

-

-

Problanco Electronics

Mexico . 2,138 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,138

-

-

-

-

TANS Electronics

Latvia . 1,355 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,355

-

-

-

-

UHIMA Technologies

Türkiye . 915 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

915

-

-

-

-

Corphita

USA . 578 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

578

-

-

-

-

Corohmni

South Africa . 348 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

348

-

-

-

-

Overview

Upgrade your digital transmission interfaces with the MTC-30132SO-I by Onsemi. Manufactured with top-notch quality and reliability, this product offers seamless connectivity and enhanced performance for a wide range of applications. From telecommunications to networking, this small outline package is designed to optimize space while delivering superior functionality. Experience the difference with Onsemi's cutting-edge technology and unlock a new level of efficiency and innovation in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and reliability for the product.

Surface Mount: YES

Being surface mountable allows for easier and more efficient installation on circuit boards.

Package Shape: RECTANGULAR

The rectangular shape offers a compact design for space-saving on PCBs.

No. of Terminals: 28

Having 28 terminals allows for versatile connectivity options and functionalities.

Package Style (Meter): SMALL OUTLINE

The small outline package style further enhances space efficiency on the circuit board.

Terminal Position: DUAL

Dual terminal position provides redundancy and ensures secure connections for stable performance.

Maximum Seated Height: 2.65 mm

The low seated height contributes to a sleek and compact overall design of the product.

Width: 7.5 mm

The narrow width enables a more streamlined layout and allows for more components to be placed on the board.

Length: 17.9 mm

The moderate length provides a balance between space-saving and accommodating necessary functionalities.

Terminal Form: GULL WING

The gull wing terminal form offers a strong mechanical connection and easier soldering during assembly.

Telecom IC Type: DIGITAL SLIC

The use of digital SLIC (Subscriber Line Interface Circuit) enhances signal quality and overall performance in telecom applications.

Terminal Pitch: 1.27 mm

The fine terminal pitch allows for high-density packaging and fine-pitch connections for optimal signal integrity.

Technical Specifications

Digital Transmission Interfaces MTC-30132SO-I attributes and parameters. Explore more Digital Transmission Interfaces devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G28

Length:

17.9 mm

No. of Terminals:

28

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

MTC-30132SO-I Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 5