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STLC5412FNTR

STMicroelectronics

STLC5412FNTR by STMicroelectronics

STLC5412FNTR by STMicroelectronics is a CMOS digital SLIC designed for industrial applications. It features a 5V nominal voltage, operates b/w -40 °C to 85°C, and comes in a compact 44-terminal chip carrier package. Ideal for reliable digital transmission interfaces in telecom systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,011 parts In-Stock

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2,011

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Vyrian

USA . 1,660 parts In-Stock

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1,660

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Anansix

USA . 196 parts In-Stock

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196

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,589 parts In-Stock

1+ parts

$6.797

100+ parts

-

1k+ parts

$6.117

10k+ parts

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1,589

$6.797

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$6.117

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MKK Technologies

India . 701 parts In-Stock

1+ parts

$12.781

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701

$12.781

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DigiPath Technology Company

USA . 701 parts In-Stock

1+ parts

$12.781

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701

$12.781

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Corphita

USA . 3,283 parts In-Stock

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3,283

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Parana Technologies

USA . 1,101 parts In-Stock

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$8.127

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1,101

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$8.127

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Overview

Elevate your digital communication systems with the STLC5412FNTR from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for reliability in harsh environments, this robust digital transmission interface ensures seamless data transfer while maximizing performance. With its compact design and industrial-grade temperature resilience, it’s ideal for telecom applications. Choose STMicroelectronics for unmatched quality and innovation that drives your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides excellent durability and resistance to environmental stress, making this product suitable for various industrial applications.

Surface Mount: YES

With surface mount capability, this product allows for efficient use of PCB space and enables automated manufacturing processes.

Package Shape: SQUARE

The square shape optimizes layout and density on printed circuit boards, making it ideal for compact designs.

No. of Terminals: 44

With 44 terminals, this device offers extensive connectivity options, accommodating complex functionality and integration.

Package Style (Meter): CHIP CARRIER

The chip carrier package style enhances thermal performance and reliability, facilitating better heat dissipation during operation.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures that the device can perform reliably in various demanding environments.

Minimum Operating Temperature: -40 °C

Operating at a minimum temperature of -40 °C allows this product to function effectively in extreme cold, making it suitable for outdoor and harsh environments.

Terminal Position: QUAD

The quad terminal position aids in better signal integrity and minimizes interference in densely populated circuit boards.

Maximum Seated Height: 4.57 mm

A low seated height of 4.57 mm allows for more compact designs, fitting into tighter spaces on PCBs.

Width: 16.5862 mm

The specific width measurement ensures compatibility with standard PCB layouts, simplifying the design process.

Length: 16.5862 mm

This exact length contributes to maintaining uniformity in design, allowing for standardization in manufacturing.

Temperature Grade: INDUSTRIAL

Having an industrial temperature grade guarantees enhanced reliability and longevity in demanding operational conditions.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high-speed performance, making this product energy-efficient and fast.

Terminal Form: J BEND

The J bend terminal form provides robust connection options, enhancing the mechanical strength of connections on the PCB.

Telecom IC Type: DIGITAL SLIC

As a digital SLIC telecom IC type, this device is well-suited for telecommunication applications, ensuring reliable digital signal handling.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is standardized for many applications, offering broad compatibility with existing systems.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for a compact design while providing adequate separation for efficient soldering and assembly.

Technical Specifications

Digital Transmission Interfaces STLC5412FNTR attributes and parameters. Explore more Digital Transmission Interfaces devices from STMicroelectronics

Specs

JESD-30 Code:

S-PQCC-J44

Length:

16.5862 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

16.5862 mm

Trade Compliance

STLC5412FNTR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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