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E-STLC3085

STMicroelectronics

E-STLC3085 by STMicroelectronics

E-STLC3085 by STMicroelectronics is a digital SLIC designed for telecom applications, featuring a low-profile flatpack with 44 terminals. It operates b/w -40 °C to 85°C and supports power supplies of 4.5V to 12V. With a PSRR of 26 dB, it ensures stable performance in industrial environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,619 parts In-Stock

1+ parts

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4,619

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Digiode

USA . 2,761 parts In-Stock

1+ parts

-

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-

1k+ parts

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2,761

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Anansix

USA . 1,284 parts In-Stock

1+ parts

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1,284

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 456 parts In-Stock

1+ parts

$9.971

100+ parts

-

1k+ parts

$8.974

10k+ parts

-

456

$9.971

-

$8.974

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MKK Technologies

India . 647 parts In-Stock

1+ parts

$18.750

100+ parts

-

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647

$18.750

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DigiPath Technology Company

USA . 647 parts In-Stock

1+ parts

$18.750

100+ parts

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647

$18.750

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Native Components

USA . 945 parts In-Stock

1+ parts

$68.394

100+ parts

-

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10k+ parts

$65.658

945

$68.394

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-

$65.658

Northwest PG Solutions

USA . 1,738 parts In-Stock

1+ parts

$75.233

100+ parts

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1,738

$75.233

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Corphita

USA . 4,285 parts In-Stock

1+ parts

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4,285

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Parana Technologies

USA . 1,412 parts In-Stock

1+ parts

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100+ parts

$11.922

1k+ parts

-

10k+ parts

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1,412

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$11.922

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Overview

Unlock seamless digital communication with the E-STLC3085 from STMicroelectronics, a leader in innovation and quality. This robust interface is designed for reliability across diverse applications—perfect for telecommunications and industrial use. Experience superior performance in harsh environments, with an impressive temperature range and low power consumption, ensuring efficiency without compromise. Elevate your projects with a trusted partner that delivers exceptional value and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making the product suitable for industrial applications.

Surface Mount: YES

Surface mount technology allows for compact design and easier automated assembly, enhancing manufacturing efficiency.

Package Shape: SQUARE

The square shape optimizes space utilization on circuit boards, facilitating high-density designs.

Power Supplies (V): 4.5/12

Supports a range of supply voltages, providing flexibility for integration into various systems.

No. of Terminals: 44

A higher number of terminals allows for richer feature sets and connectivity options, enhancing application versatility.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile design is ideal for applications where space is critical, ensuring easy integration onto PCBs.

Maximum Operating Temperature: 85 °C

Withstand high operating temperatures, ensuring reliability and performance in demanding environments.

Battery Supply (V): -64

Negative voltage capability allows for innovative circuit designs and compatibility with more complex systems.

Minimum Operating Temperature: -40 °C

Operating in extreme cold enhances performance in a wide range of environmental conditions, suitable for outdoor and harsh applications.

Terminal Position: QUAD

Quad terminal positioning facilitates better routing and design flexibility on PCBs.

Maximum Seated Height: 1.6 mm

Low seated height contributes to compact designs, beneficial in portable device applications.

Width: 10 mm

Standard width for easy integration into established designs without special modifications.

Minimum Power Supply Rejection Ratio (PSRR): 26 dB

A solid PSRR ensures stable performance under varying load conditions, crucial for reliable digital signals.

Battery Feed: CONSTANT CURRENT

Constant current battery feed aids in consistent performance and longer device life.

Length: 10 mm

A compact length enables efficient space usage on circuit boards, facilitating space-constricted designs.

Temperature Grade: INDUSTRIAL

Industrial-grade components are engineered for robustness, ensuring longevity and reliability in challenging environments.

Technology: BCDMOS

BCDMOS technology delivers high performance with low power consumption, enhancing efficiency in digital transmission.

Terminal Form: GULL WING

Gull wing terminals provide better solder joint reliability, ensuring long-term connectivity.

Maximum Supply Current: 0.09 mA

Low supply current maximizes energy efficiency, suitable for battery-powered devices.

Telecom IC Type: DIGITAL SLIC

As a digital SLIC, this product is tailored specifically for telecom applications, ensuring optimal performance.

Nominal Supply Voltage: 6 V

Operating at a nominal voltage of 6V is standard for many digital devices, improving compatibility.

Hybrid 2-4 CONVERSION

Supports hybrid conversion, allowing for flexible application in communication systems and enhancing performance.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch is suitable for high-density layouts, promoting miniaturization of electronic designs.

Technical Specifications

Digital Transmission Interfaces E-STLC3085 attributes and parameters. Explore more Digital Transmission Interfaces devices from STMicroelectronics

Specs

Battery Feed:

CONSTANT CURRENT

Battery Supply (V):

-64

Hybrid:

2-4 CONVERSION

JESD-30 Code:

S-PQFP-G44

Length:

10 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Power Supply Rejection Ratio (PSRR):

26 dB

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

4.5/12

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Analog Transmission Interfaces

Maximum Supply Current:

.09 mA

Nominal Supply Voltage:

6 V

Surface Mount:

YES

Technology:

BCDMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

E-STLC3085 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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