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E-STLC3075

STMicroelectronics

E-STLC3075 by STMicroelectronics

E-STLC3075 by STMicroelectronics is a digital SLIC designed for telecom applications, featuring a wide supply voltage range of 4.5-12V and operating temps from -40 °C to 85°C. It has a low profile flatpack design with 44 terminals and offers excellent PSRR of 26 dB. Ideal for industrial use, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,011 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,011

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-

-

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Vyrian

USA . 2,084 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,084

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Anansix

USA . 1,897 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,897

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,261 parts In-Stock

1+ parts

$12.224

100+ parts

-

1k+ parts

$11.002

10k+ parts

-

2,261

$12.224

-

$11.002

-

MKK Technologies

India . 951 parts In-Stock

1+ parts

$22.987

100+ parts

-

1k+ parts

-

10k+ parts

-

951

$22.987

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-

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DigiPath Technology Company

USA . 951 parts In-Stock

1+ parts

$22.987

100+ parts

-

1k+ parts

-

10k+ parts

-

951

$22.987

-

-

-

Native Components

USA . 478 parts In-Stock

1+ parts

$78.285

100+ parts

-

1k+ parts

-

10k+ parts

$75.154

478

$78.285

-

-

$75.154

Northwest PG Solutions

USA . 1,000 parts In-Stock

1+ parts

$86.114

100+ parts

-

1k+ parts

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10k+ parts

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1,000

$86.114

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-

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Parana Technologies

USA . 2,272 parts In-Stock

1+ parts

-

100+ parts

$14.616

1k+ parts

-

10k+ parts

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2,272

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$14.616

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Corphita

USA . 2,206 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,206

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Overview

Unlock seamless digital communication with the E-STLC3075 from STMicroelectronics, a leader in innovative technology. This high-performance interface offers exceptional reliability and efficiency, perfect for diverse applications—ranging from telecom to industrial systems. With robust temperature tolerance and minimal power consumption, it ensures your designs are not only advanced but also cost-effective. Experience unparalleled support and quality from a trusted name, enhancing your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and reduces weight, making the product ideal for various applications.

Surface Mount: YES

Surface mount technology allows for compact and efficient circuit designs, facilitating easier integration into modern electronics.

Package Shape: SQUARE

A square package shape provides efficient layout options on PCBs, optimizing space utilization.

Power Supplies (V): 4.5/12

Versatile power supply options make this product adaptable for different circuit configurations.

No. of Terminals: 44

A higher number of terminals allows for more functionality and connectivity within the device.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile design is ideal for space-constrained applications while maintaining performance.

Maximum Operating Temperature: 85 °C

Operating at higher temperatures ensures reliability in demanding environments, suitable for industrial applications.

Battery Supply (V): -74

This negative battery supply option provides versatility for specific circuit requirements in telecom applications.

Minimum Operating Temperature: -40 °C

The product's ability to operate in low temperatures makes it robust for extreme weather conditions.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides excellent solderability and corrosion resistance, ensuring long-term reliability.

Terminal Position: QUAD

Quad terminal positioning enhances connection stability, appealing for complex digital interface applications.

Maximum Seated Height: 1.6 mm

A compact seated height allows for better integration into low-profile devices, enhancing design flexibility.

Width: 10 mm

A standardized width facilitates easy integration into existing PCB layouts and designs.

Minimum Power Supply Rejection Ratio (PSRR): 26 dB

A decent PSRR ensures stable operation by effectively rejecting noise, which is crucial in digital communications.

Battery Feed: CONSTANT CURRENT

Constant current feed optimizes performance and ensures device stability throughout its operation.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures compatibility with standard soldering processes, making assembly more efficient.

Peak Reflow Temperature °C: 260

A high peak reflow temperature capability ensures robustness for industrial use during assembly.

Length: 10 mm

A compact length aids in the efficient use of PCB space while delivering necessary functionality.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product guarantees reliability in harsh operating conditions.

Technology: BCDMOS

BCD technology allows for high performance and efficiency, making this product suitable for complex digital transmission.

Terminal Form: GULL WING

Gull wing terminals provide a secure mechanical and electrical connection, enhancing reliability in performance.

Maximum Supply Current: 0.09 mA

Low supply current consumption is advantageous for energy-efficient designs, especially in battery-powered applications.

Telecom IC Type: DIGITAL SLIC

Specifically designed as a digital SLIC, this product is tailor-made for telecom applications, ensuring optimal performance.

Nominal Supply Voltage: 6 V

The nominal supply voltage aligns with common voltage standards, making it easy to integrate into various systems.

Hybrid 2-4 CONVERSION

The capability for hybrid conversion supports both analog and digital communications, enhancing flexibility in design.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch is standard in many designs, facilitating seamless integration with other components.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates compatibility with standard manufacturing processes, facilitating ease of handling and assembly.

Technical Specifications

Digital Transmission Interfaces E-STLC3075 attributes and parameters. Explore more Digital Transmission Interfaces devices from STMicroelectronics

Specs

Battery Feed:

CONSTANT CURRENT

Battery Supply (V):

-74

Hybrid:

2-4 CONVERSION

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Power Supply Rejection Ratio (PSRR):

26 dB

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.5/12

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Analog Transmission Interfaces

Maximum Supply Current:

.09 mA

Nominal Supply Voltage:

6 V

Surface Mount:

YES

Technology:

BCDMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

E-STLC3075 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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