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AFE1205E

Texas Instruments

AFE1205E by Texas Instruments

AFE1205E by Texas Instruments is a digital transmission interface IC with 48 terminals, operating at -40 to 85°C. It features a supply voltage of 3.3V, data rate of 2.32 Mbps, and CMOS technology. Ideal for telecom applications as a digital SLIC, it comes in a small outline package with gull wing terminals for surface mounting.

Median Price

$11.060

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,870 parts In-Stock

1+ parts

-

100+ parts

$9.570

1k+ parts

$8.560

10k+ parts

$8.060

6,870

-

$9.570

$8.560

$8.060

DigiKey

USA . 6,870 parts In-Stock

1+ parts

-

100+ parts

$11.060

1k+ parts

-

10k+ parts

-

6,870

-

$11.060

-

-

Verical

USA . 4,980 parts In-Stock

1+ parts

-

100+ parts

$11.963

1k+ parts

$10.700

10k+ parts

$10.075

4,980

-

$11.963

$10.700

$10.075

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,838 parts In-Stock

1+ parts

$10.098

100+ parts

-

1k+ parts

-

10k+ parts

-

2,838

$10.098

-

-

-

Vyrian

USA . 1,129 parts In-Stock

1+ parts

$10.630

100+ parts

-

1k+ parts

-

10k+ parts

-

1,129

$10.630

-

-

-

DigiKey Marketplace

USA . 6,870 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,870

-

-

-

-

Prism Electronics

USA . 231 parts In-Stock

1+ parts

-

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231

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 20 parts In-Stock

1+ parts

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20

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 431 parts In-Stock

1+ parts

$0.256

100+ parts

-

1k+ parts

-

10k+ parts

$0.246

431

$0.256

-

-

$0.246

Northwest PG Solutions

USA . 1,156 parts In-Stock

1+ parts

$0.282

100+ parts

-

1k+ parts

-

10k+ parts

$0.248

1,156

$0.282

-

-

$0.248

Parana Technologies

USA . 1,635 parts In-Stock

1+ parts

$8.725

100+ parts

-

1k+ parts

$9.405

10k+ parts

-

1,635

$8.725

-

$9.405

-

One Stop Electronics

USA . 4,503 parts In-Stock

1+ parts

$9.040

100+ parts

-

1k+ parts

-

10k+ parts

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4,503

$9.040

-

-

-

Corphita

USA . 4,685 parts In-Stock

1+ parts

$9.567

100+ parts

-

1k+ parts

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10k+ parts

-

4,685

$9.567

-

-

-

DigiPath Technology Company

USA . 1,349 parts In-Stock

1+ parts

$9.607

100+ parts

-

1k+ parts

-

10k+ parts

-

1,349

$9.607

-

-

-

ChromeModa Solutions

Germany . 3,448 parts In-Stock

1+ parts

$9.803

100+ parts

$8.038

1k+ parts

-

10k+ parts

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3,448

$9.803

$8.038

-

-

IDEA Electronic Components Group

UK . 394 parts In-Stock

1+ parts

$9.803

100+ parts

$9.313

1k+ parts

$8.823

10k+ parts

-

394

$9.803

$9.313

$8.823

-

Glotronic Ltd.

UK . 3,700 parts In-Stock

1+ parts

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3,700

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Perfect Parts

USA . 259 parts In-Stock

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259

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Microchip USA

USA . 229 parts In-Stock

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229

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iodParts Technologies Inc.

India . 1 parts In-Stock

1+ parts

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100+ parts

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1

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-

Overview

Unlock the full potential of your digital transmission interfaces with the AFE1205E from Texas Instruments. Designed with precision and reliability in mind, this telecom IC offers unparalleled performance and versatility for a wide range of applications. With a compact package style and dual terminal position, this high-quality product ensures seamless integration into your systems. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations. Elevate your projects with the AFE1205E and experience the difference in quality and value it brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, allowing for easy handling and long-lasting performance.

Surface Mount: YES

The surface mount capability makes installation of the product quick and easy, saving time and effort in assembly processes.

Power Supplies (V): 3.3,5

The product supports multiple power supply options, providing flexibility in different applications and environments.

No. of Terminals: 48

With a high number of terminals, the product enables complex connections and interfaces, expanding its compatibility and functionality.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style allows for space-saving design and efficient use of board area, making it ideal for compact devices and systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable performance even in demanding conditions, enhancing the product's durability and usability.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, the product can withstand cold environments, making it suitable for a wide range of applications.

Terminal Position: DUAL

The dual terminal position provides redundancy and increased reliability in connections, reducing the risk of signal loss or interruption.

Maximum Seated Height: 2.79 mm

The low maximum seated height allows for a slim profile and compact design, making the product suitable for space-constrained applications.

Width: 7.5 mm

The small width dimension adds to the product's compactness and versatility, enabling easy integration into various systems and devices.

Length: 15.875 mm

The moderate length dimension provides a balance between space efficiency and functionality, making the product versatile for different design requirements.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can withstand harsh operating conditions, making it suitable for industrial and rugged environments.

Technology: CMOS

The CMOS technology offers low power consumption and high speed operation, contributing to energy efficiency and performance optimization of the product.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and secure soldering points, ensuring reliable and robust connections for the product.

Telecom IC Type: DIGITAL SLIC

The use of digital SLIC technology enhances signal integrity and communication quality, making the product suitable for telecom and digital transmission applications.

Nominal Supply Voltage: 3.3 V

With a stable nominal supply voltage of 3.3V, the product ensures consistent and reliable power delivery, contributing to overall system performance.

Terminal Pitch: 0.635 mm

The tight terminal pitch allows for high-density packaging and efficient use of space on the PCB, enabling compact and cost-effective designs.

Data Rate: 2.32 Mbps

The high data rate capability of 2.32 Mbps supports fast and efficient data transmission, making the product suitable for high-speed digital communication applications.

Technical Specifications

Digital Transmission Interfaces AFE1205E attributes and parameters. Explore more Digital Transmission Interfaces devices from Texas Instruments

Specs

Data Rate:

2.32 Mbps

JESD-30 Code:

R-PDSO-G48

Length:

15.875 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP48,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

AFE1205E Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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