Loading...

E-STLC3055N

STMicroelectronics

E-STLC3055N by STMicroelectronics

E-STLC3055N by STMicroelectronics is a digital SLIC designed for telecom applications, featuring a 6V nominal voltage and operating b/w -40 °C to 85 °C. It has a low profile flatpack design with 44 terminals and offers a PSRR of 26 dB. This robust IC ensures reliable performance in industrial environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,928 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,928

-

-

-

-

Digiode

USA . 4,284 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,284

-

-

-

-

Anansix

USA . 321 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

321

-

-

-

-

Speed Components Ltd

Israel . 230 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

230

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 104 parts In-Stock

1+ parts

$7.094

100+ parts

-

1k+ parts

-

10k+ parts

-

104

$7.094

-

-

-

IDEA Electronic Components Group

UK . 544 parts In-Stock

1+ parts

$14.575

100+ parts

-

1k+ parts

$13.117

10k+ parts

-

544

$14.575

-

$13.117

-

AZTECH Wire

Italy . 458 parts In-Stock

1+ parts

$17.130

100+ parts

-

1k+ parts

-

10k+ parts

-

458

$17.130

-

-

-

MKK Technologies

India . 466 parts In-Stock

1+ parts

$27.407

100+ parts

-

1k+ parts

-

10k+ parts

-

466

$27.407

-

-

-

DigiPath Technology Company

USA . 466 parts In-Stock

1+ parts

$27.407

100+ parts

-

1k+ parts

-

10k+ parts

-

466

$27.407

-

-

-

Native Components

USA . 505 parts In-Stock

1+ parts

$94.622

100+ parts

-

1k+ parts

-

10k+ parts

$90.837

505

$94.622

-

-

$90.837

Northwest PG Solutions

USA . 891 parts In-Stock

1+ parts

$104.084

100+ parts

-

1k+ parts

-

10k+ parts

-

891

$104.084

-

-

-

Corphita

USA . 779 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

779

-

-

-

-

Parana Technologies

USA . 260 parts In-Stock

1+ parts

-

100+ parts

$17.426

1k+ parts

-

10k+ parts

-

260

-

$17.426

-

-

Overview

Elevate your digital communication systems with the E-STLC3055N from STMicroelectronics, a trusted leader in innovative solutions. Crafted for durability and efficiency, this low-profile interface chip ensures exceptional performance in demanding environments, making it ideal for industrial applications. Experience unparalleled reliability and seamless integration, empowering your designs with advanced technology that drives productivity and enhances connectivity. Choose STMicroelectronics for quality you can count on!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and ensures resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient use of board space and simplifies assembly processes, optimizing manufacturing efficiency.

Package Shape: SQUARE

The square shape facilitates easy integration into different circuit configurations and improves thermal management.

Power Supplies (V): 5.5/12

Wide operating voltage supports versatility in power supply options, making it adaptable for various systems.

No. of Terminals: 44

A higher number of terminals allows for more connections, enabling complex functionality and better signal handling.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile design ensures space efficiency, making it a great choice for compact electronic devices.

Maximum Operating Temperature: 85 °C

High operating temperature limits ensure reliability in challenging environments, making it suitable for industrial applications.

Battery Supply (V): -74

This negative battery supply option indicates versatility in power management, ideal for specialized applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures functionality in extreme conditions, enhancing its reliability for outdoor and industrial use.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides excellent solderability and corrosion resistance, ensuring long-term reliability.

Terminal Position: QUAD

Quad terminal positioning enhances the product's spatial efficiency and allows for better routing on circuit boards.

Maximum Seated Height: 1.6 mm

Low seated height is ideal for applications where space is limited, allowing for more compact designs.

Width: 10 mm

Moderate width offers a balance between compactness and functionality, suitable for diverse electronic applications.

Minimum Power Supply Rejection Ratio (PSRR): 26 dB

A good PSRR ensures stable operation by minimizing the effects of supply voltage variations, enhancing performance.

Battery Feed: CONSTANT CURRENT

Constant current feeding offers consistent performance and reliability in battery-powered applications.

Maximum Time At Peak Reflow Temperature (s): 30

Extended reflow time ensures robust solder joints, leading to higher reliability in assembled products.

Peak Reflow Temperature °C: 260

High reflow temperature capability allows compatibility with various solder types, improving assembly options.

Length: 10 mm

Standard length maintains compatibility with various PCB layouts while ensuring efficient space usage.

Temperature Grade: INDUSTRIAL

Industrial-grade components are designed for reliability in demanding environments, making this product a robust choice.

Technology: BCDMOS

BCD technology combines high-voltage and low-voltage operations in one chip, providing versatility in digital transmission applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and are easier to solder, improving manufacturing reliability.

Maximum Supply Current: 0.09 mA

Low supply current ensures energy efficiency, making it ideal for battery-powered and power-sensitive designs.

Telecom IC Type: DIGITAL SLIC

A digital SLIC (Subscriber Line Interface Circuit) provides high-performance voice and data transmission, crucial for modern telecommunications.

Nominal Supply Voltage: 6 V

Nominal voltage compatibility with common power supplies enhances ease of integration into existing systems.

Hybrid 2-4 CONVERSION: YES

Hybrid conversion capability ensures versatility in interfacing with various systems, making it suitable for diverse applications.

Terminal Pitch: 0.8 mm

A standard terminal pitch supports compatibility with a wide range of PCB designs, easing integration.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates a moderate sensitivity to moisture, thereby requiring appropriate handling precautions, helping ensure longevity.

Technical Specifications

Digital Transmission Interfaces E-STLC3055N attributes and parameters. Explore more Digital Transmission Interfaces devices from STMicroelectronics

Specs

Battery Feed:

CONSTANT CURRENT

Battery Supply (V):

-74

Hybrid:

2-4 CONVERSION

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Power Supply Rejection Ratio (PSRR):

26 dB

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5.5/12

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Analog Transmission Interfaces

Maximum Supply Current:

.09 mA

Nominal Supply Voltage:

6 V

Surface Mount:

YES

Technology:

BCDMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

E-STLC3055N Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 3