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78P2362-IH

Texas Instruments

78P2362-IH by Texas Instruments

Texas Instruments' 78P2362-IH is a PCM transceiver with 28 terminals in an industrial-grade square package. Operating b/w -40 to 85 °C, it has a 5V supply voltage and J bend terminal form. Ideal for digital transmission interfaces, this IC offers reliable performance in various telecom applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

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Digiode

USA . 2,688 parts In-Stock

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Vyrian

USA . 1,375 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 156 parts In-Stock

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Greenchips

USA . 138 parts In-Stock

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SIE Connect GmbH - GreenChips

Germany . 138 parts In-Stock

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138

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ComSIT Distribution GmbH

Germany . 79 parts In-Stock

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79

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ComSIT USA

USA . 79 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 30 parts In-Stock

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Prism Electronics

USA . 12 parts In-Stock

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Zilex Electronics Inc.

Canada . 10 parts In-Stock

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AZTECH Wire

Italy . 823 parts In-Stock

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$5.937

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$5.937

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Parana Technologies

USA . 24 parts In-Stock

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$14.052

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$1,304.961

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$12.647

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DigiPath Technology Company

USA . 2,026 parts In-Stock

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$15.473

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$14.235

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ChromeModa Solutions

Germany . 5,589 parts In-Stock

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$12.947

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IDEA Electronic Components Group

UK . 294 parts In-Stock

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$15.000

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$14.210

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Native Components

USA . 547 parts In-Stock

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$21.599

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Northwest PG Solutions

USA . 1,040 parts In-Stock

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$23.759

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$21.383

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One Stop Electronics

USA . 1,473 parts In-Stock

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$991.000

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Corphita

USA . 893 parts In-Stock

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Perfect Parts

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SIE Connect GmbH (Excess)

Germany . 2 parts In-Stock

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Overview

Enhance your digital transmission interfaces with the 78P2362-IH by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge solutions for various industries. Whether you're in telecommunications, networking, or industrial automation, this PCM transceiver offers unmatched performance and efficiency. With a wide temperature range and durable construction, this product ensures seamless operation even in challenging environments. Upgrade your system today with the 78P2362-IH and experience the superior value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers durability and resistance to environmental factors, making the product suitable for a wide range of applications.

No. of Terminals: 28

Having 28 terminals allows for versatile connectivity options and functionality, making it a comprehensive digital transmission interface.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand heat-intensive environments and ensure reliable performance.

Nominal Supply Voltage: 5 V

The 5V supply voltage ensures stable power input for efficient operation and consistent signal transmission.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for compact design and efficient use of space, making the product suitable for applications with limited room.

Technical Specifications

Digital Transmission Interfaces 78P2362-IH attributes and parameters. Explore more Digital Transmission Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J28

Length:

11.5062 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.572 mm

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

11.5062 mm

Trade Compliance

78P2362-IH Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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