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78P2361-IH

Texas Instruments

78P2361-IH by Texas Instruments

78P2361-IH by Texas Instruments is a PCM transceiver IC with 28 terminals in a square chip carrier package. It operates b/w -40°C to 85°C, suitable for industrial applications. With a nominal voltage of 5V and J bend terminal form, it's ideal for digital transmission interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,222 parts In-Stock

1+ parts

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4,222

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Digiode

USA . 1,781 parts In-Stock

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1,781

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 682 parts In-Stock

1+ parts

$1.250

100+ parts

-

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682

$1.250

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Northwest PG Solutions

USA . 1,535 parts In-Stock

1+ parts

$1.375

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-

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1,535

$1.375

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AZTECH Wire

Italy . 592 parts In-Stock

1+ parts

$7.490

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592

$7.490

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Parana Technologies

USA . 576 parts In-Stock

1+ parts

$15.720

100+ parts

-

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$16.084

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576

$15.720

-

$16.084

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DigiPath Technology Company

USA . 2,109 parts In-Stock

1+ parts

$17.310

100+ parts

$15.925

1k+ parts

-

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2,109

$17.310

$15.925

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ChromeModa Solutions

Germany . 4,233 parts In-Stock

1+ parts

$17.663

100+ parts

$14.484

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4,233

$17.663

$14.484

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IDEA Electronic Components Group

UK . 2,238 parts In-Stock

1+ parts

$17.663

100+ parts

$16.780

1k+ parts

$15.897

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2,238

$17.663

$16.780

$15.897

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One Stop Electronics

USA . 1,335 parts In-Stock

1+ parts

$922.000

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1,335

$922.000

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Corphita

USA . 253 parts In-Stock

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253

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Overview

Enhance your digital transmission interfaces with the Texas Instruments 78P2361-IH. Crafted with precision and expertise by a trusted manufacturer, this PCM transceiver boasts exceptional quality and reliability. Ideal for industrial applications, this chip carrier package offers seamless communication solutions with its high-performance features. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations, providing you with value, benefits, and advantages that elevate your projects to new heights. Elevate your digital transmission experience today with the 78P2361-IH.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto printed circuit boards, saving time and labor costs in production.

Package Shape: SQUARE

The square package shape helps in optimizing space on the PCB, allowing for more efficient layout and design of the overall system.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand harsh environmental conditions, making it suitable for industrial applications.

Telecom IC Type: PCM TRANSCEIVER

The PCM transceiver type ensures reliable and high-quality transmission of digital data over communication networks, making it a trustworthy choice for telecom applications.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V, this product is compatible with standard power sources commonly found in electronic systems, ensuring easy integration.

Technical Specifications

Digital Transmission Interfaces 78P2361-IH attributes and parameters. Explore more Digital Transmission Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J28

Length:

11.5062 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.572 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.5062 mm

Trade Compliance

78P2361-IH Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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