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78P2362-IP

Texas Instruments

78P2362-IP by Texas Instruments

The Texas Instruments 78P2362-IP is a PCM transceiver IC with 28 terminals in an in-line package. It operates b/w -40°C to 85°C, suitable for industrial applications. With a nominal voltage of 5V, it offers dual terminal positions and through-hole terminal form.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,836 parts In-Stock

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3,836

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Vyrian

USA . 3,417 parts In-Stock

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3,417

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Resion

USA . 44 parts In-Stock

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44

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Prism Electronics

USA . 10 parts In-Stock

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10

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Distributors (Availability)

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AZTECH Wire

Italy . 429 parts In-Stock

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$10.015

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429

$10.015

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Parana Technologies

USA . 1,640 parts In-Stock

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$14.539

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$14.977

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1,640

$14.539

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$14.977

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DigiPath Technology Company

USA . 2,182 parts In-Stock

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$16.009

100+ parts

$14.729

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2,182

$16.009

$14.729

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ChromeModa Solutions

Germany . 2,848 parts In-Stock

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$16.336

100+ parts

$13.396

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2,848

$16.336

$13.396

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IDEA Electronic Components Group

UK . 312 parts In-Stock

1+ parts

$16.336

100+ parts

$15.519

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$14.702

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312

$16.336

$15.519

$14.702

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One Stop Electronics

USA . 607 parts In-Stock

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$465.000

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607

$465.000

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Northwest PG Solutions

USA . 645 parts In-Stock

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645

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Native Components

USA . 344 parts In-Stock

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344

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Corphita

USA . 299 parts In-Stock

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299

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Perfect Parts

USA . 11 parts In-Stock

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Overview

Unlock seamless digital transmission with the 78P2362-IP by Texas Instruments. Crafted with precision and expertise, this PCM transceiver boasts unparalleled quality and reliability for industrial applications. From its durable package body material to its innovative terminal form, this telecom IC is designed to exceed expectations. Experience the value of superior performance, efficient operation, and effortless connectivity with the 78P2362-IP. Elevate your projects with Texas Instruments' cutting-edge technology and revolutionize the way you transmit data.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components, making the product reliable for long-term use.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high temperatures, making it suitable for a wide range of operating environments.

Terminal Form: THROUGH-HOLE

The through-hole terminal form ensures secure connections and ease of assembly, enhancing the overall reliability of the product.

Telecom IC Type: PCM TRANSCEIVER

The PCM transceiver telecom IC type indicates that the product is designed for digital transmission applications, providing efficient and reliable data transfer.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources, making this product versatile and easy to integrate into existing systems.

Technical Specifications

Digital Transmission Interfaces 78P2362-IP attributes and parameters. Explore more Digital Transmission Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T28

Length:

35.941 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.588 mm

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

78P2362-IP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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