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ST5421CFN

STMicroelectronics

ST5421CFN by STMicroelectronics

ST5421CFN by STMicroelectronics is a CMOS ISDN loop extender circuit with a 5V nominal supply and operates at data rates of 0.192 Mbps. It features a compact chip carrier package with 28 terminals, supporting temperatures from 0 °C to 70°C. Ideal for digital transmission interfaces in telecom applications, it ensures reliable connectivity.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,781 parts In-Stock

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4,781

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ComSIT Distribution GmbH

Germany . 2,900 parts In-Stock

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2,900

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Digiode

USA . 2,292 parts In-Stock

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2,292

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Anansix

USA . 434 parts In-Stock

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434

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ECAB

Sweden . 315 parts In-Stock

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315

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Q Components

USA . 85 parts In-Stock

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85

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,518 parts In-Stock

1+ parts

$11.761

100+ parts

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$10.585

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1,518

$11.761

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$10.585

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MKK Technologies

India . 766 parts In-Stock

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$22.116

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766

$22.116

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DigiPath Technology Company

USA . 766 parts In-Stock

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$22.116

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766

$22.116

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Corphita

USA . 3,524 parts In-Stock

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3,524

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Parana Technologies

USA . 2,289 parts In-Stock

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$14.062

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2,289

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$14.062

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Overview

Unlock seamless connectivity with the ST5421CFN from STMicroelectronics, a trusted leader in innovative digital transmission interfaces. Designed for superior performance, this compact chip carrier ensures reliable ISDN loop extension, perfect for enhancing communication systems in various applications. With robust temperature resilience and easy surface mount integration, it empowers customers to achieve efficient, high-quality data transmission effortlessly—driving productivity and innovation forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures longevity and reliability in various environmental conditions.

Surface Mount: YES

Surface mount technology allows for compact design and easier integration into modern electronics.

Package Shape: SQUARE

The square shape enables efficient use of board space and facilitates the design of tight layouts.

Power Supplies (V): 5

Operates on a common power supply voltage, making it compatible with a wide range of devices.

ISDN Access Rate: BASIC

Supports basic ISDN access rates, ideal for standard communication applications.

No. of Terminals: 28

A sufficient number of terminals allows for comprehensive connectivity options for various functions.

Package Style (Meter): CHIP CARRIER

The chip carrier style provides effective thermal management and reduces signal integrity issues.

Maximum Operating Temperature: 70 °C

A high maximum operating temperature allows the product to perform well in demanding environments.

Minimum Output High Voltage: 2.4 V

The minimum output high voltage ensures reliable performance in logic high states, enhancing system stability.

Minimum Operating Temperature: 0 °C

Can operate in low-temperature conditions without failure, increasing its usability in various climates.

Terminal Finish: TIN LEAD

Tin lead terminals provide excellent solderability and are widely accepted in the industry.

Terminal Position: QUAD

Quad terminal positioning enhances connectivity and makes layout design more flexible.

Reference Point: S/T

A clear reference point simplifies installation and ensures correct connections in ISDN environments.

Maximum Seated Height: 4.57 mm

Compact height ensures it fits well in space-constrained PCBs, allowing for versatile applications.

Width: 11.5062 mm

The standard width facilitates easy mounting while maximizing board space efficiency.

Maximum Output Low Current: 3.2 Amp

Capable of handling significant output low currents, making it suitable for various load requirements.

Length: 11.5062 mm

An optimal length that balances component size with performance, fitting into various circuit configurations.

Temperature Grade: COMMERCIAL

Designed for commercial applications, ensuring reliability and compliance in typical operating conditions.

Technology: CMOS

CMOS technology ensures low power consumption and high speed, beneficial for modern digital applications.

Terminal Form: J BEND

J bend design promotes easy handling and placement during assembly, reducing manufacturing time.

Telecom IC Type: ISDN LOOP EXTENDER CIRCUIT

Specifically designed as an ISDN loop extender, it enhances telecommunications systems effectively.

Nominal Supply Voltage: 5 V

The nominal supply voltage aligns with industry standards, ensuring compatibility with other devices.

Terminal Pitch: 1.27 mm

A standard terminal pitch that simplifies PCB layout and component placement.

Maximum Output Low Voltage: 0.4 V

Low maximum output voltage ensures compatibility with sensitive digital circuits without causing damage.

Standard: CCITT I.430

Complies with international standards, ensuring reliability and interoperability in telecommunications.

Data Rate: 0.192 Mbps

A suitable data rate for ISDN applications, providing sufficient bandwidth for standard digital communications.

Technical Specifications

Digital Transmission Interfaces ST5421CFN attributes and parameters. Explore more Digital Transmission Interfaces devices from STMicroelectronics

Specs

Data Rate:

.192 Mbps

ISDN Access Rate:

BASIC

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.5062 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Output High Voltage:

2.4 V

Maximum Output Low Current:

3.2 Amp

Maximum Output Low Voltage:

.4 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Reference Point:

S/T

Maximum Seated Height:

4.57 mm

Standard:

CCITT I.430

Sub-Category:

Digital Transmission Interfaces

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.5062 mm

Trade Compliance

ST5421CFN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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