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ST5421CP

STMicroelectronics

ST5421CP by STMicroelectronics

ST5421CP by STMicroelectronics is a CMOS ISDN loop extender circuit with a 5V supply and operates at data rates of 0.192 Mbps. It features a max operating temp of 70 °C, 20 terminals, and comes in an in-line package. Ideal for digital transmission interfaces in telecom applications.

Median Price

$4.500

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Global Solutions Electronics Company

USA . 400 parts In-Stock

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$4.500

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400

$4.500

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Tectiva GmbH

Germany . 4,777 parts In-Stock

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4,777

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Vyrian

USA . 1,955 parts In-Stock

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1,955

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Digiode

USA . 1,471 parts In-Stock

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1,471

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Anansix

USA . 827 parts In-Stock

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827

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R&J Components

USA . 17 parts In-Stock

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LWI Electronics Inc

India . 10 parts In-Stock

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10

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,229 parts In-Stock

1+ parts

$10.082

100+ parts

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1k+ parts

$9.074

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1,229

$10.082

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$9.074

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MKK Technologies

India . 17 parts In-Stock

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$18.959

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17

$18.959

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DigiPath Technology Company

USA . 17 parts In-Stock

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$18.959

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17

$18.959

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Corphita

USA . 2,232 parts In-Stock

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Parana Technologies

USA . 1,428 parts In-Stock

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$12.055

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1,428

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$12.055

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Overview

Elevate your digital connectivity with the ST5421CP from STMicroelectronics—where quality meets reliability. Designed for seamless ISDN integration, this compact interface ensures robust performance across a range of applications like telecom systems and data transmission. With STMicroelectronics' reputation for innovation and excellence, you can trust the ST5421CP to deliver exceptional value, enhancing your projects with enhanced efficiency and durability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and protects the internal components, making this product suitable for various environments.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on circuit boards, facilitating design flexibility.

Power Supplies (V): 5

Operating at a standard 5V power supply makes integration easy with commonly used electronic systems, enhancing compatibility.

ISDN Access Rate: BASIC

Support for basic ISDN access rates ensures reliable communication for essential applications, particularly in legacy systems.

No. of Terminals: 20

A generous number of terminals allows for versatile connectivity options and supports complex circuit designs.

Package Style (Meter): IN-LINE

The in-line package style simplifies installation in data transmission applications, ensuring a neat and efficient setup.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product is suitable for various operating environments without overheating issues.

Minimum Output High Voltage: 2.4 V

A minimum output high voltage of 2.4V ensures proper signaling levels, making it compatible with a variety of digital systems.

Minimum Operating Temperature: 0 °C

Operating down to 0 °C ensures functionality in cooler environments, providing versatility in application.

Terminal Finish: TIN LEAD

The tin-lead terminal finish enhances solderability, contributing to reliable and long-lasting connections.

Terminal Position: DUAL

Dual terminal positioning allows for easier routing and organization of connections on circuit boards.

Reference Point: S/T

The S/T reference point standardizes the connection interface for easy integration into existing systems.

Maximum Seated Height: 3.93 mm

A low seated height of 3.93 mm ensures compatibility with low-profile designs, accommodating space-constrained environments.

Width: 7.62 mm

The compact width supports high-density applications, maximizing layout efficiency.

Maximum Output Low Current: 3.2 Amp

A maximum output low current of 3.2 Amps allows for the handling of significant current loads, enhancing device performance.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates reliability in typical environmental conditions, suitable for most industrial applications.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high-speed performance, making it ideal for energy-efficient designs.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides robust connections, making the product suitable for various assembly techniques.

Telecom IC Type: ISDN LOOP EXTENDER CIRCUIT

As an ISDN loop extender circuit, this product enhances communication range, making it optimal for ISDN setups.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V simplifies design considerations and is widely adopted in the industry.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm offers compatibility with standard PCB layouts, making it easy to incorporate in designs.

Maximum Output Low Voltage: 0.4 V

A low output voltage of 0.4V helps maintain signal integrity while ensuring clear logic level communication.

Standard: CCITT I.430

Compliance with CCITT I.430 standards guarantees compatibility with ISDN systems, ensuring reliable telecommunications.

Data Rate: 0.192 Mbps

A data rate of 0.192 Mbps meets the needs for moderate-speed data transmission, making it suitable for a variety of applications.

Technical Specifications

Digital Transmission Interfaces ST5421CP attributes and parameters. Explore more Digital Transmission Interfaces devices from STMicroelectronics

Specs

Data Rate:

.192 Mbps

ISDN Access Rate:

BASIC

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Output High Voltage:

2.4 V

Maximum Output Low Current:

3.2 Amp

Maximum Output Low Voltage:

.4 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Reference Point:

S/T

Maximum Seated Height:

3.93 mm

Standard:

CCITT I.430

Sub-Category:

Digital Transmission Interfaces

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

ST5421CP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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