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ST5410

STMicroelectronics

ST5410 by STMicroelectronics

ST5410 by STMicroelectronics is a digital transmission interface with 28 terminals, operating at 5V. It features a basic ISDN access rate and CMOS technology, suitable for telecom applications like digital SLIC. The package style is in-line, with a rectangular shape and ceramic, glass-sealed body material.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,088 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,088

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-

-

-

Anansix

USA . 2,130 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,130

-

-

-

-

Vyrian

USA . 2,116 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,116

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 265 parts In-Stock

1+ parts

$9.501

100+ parts

-

1k+ parts

$8.551

10k+ parts

-

265

$9.501

-

$8.551

-

MKK Technologies

India . 2,194 parts In-Stock

1+ parts

$17.866

100+ parts

-

1k+ parts

-

10k+ parts

-

2,194

$17.866

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-

-

DigiPath Technology Company

USA . 2,194 parts In-Stock

1+ parts

$17.866

100+ parts

-

1k+ parts

-

10k+ parts

-

2,194

$17.866

-

-

-

Corphita

USA . 1,765 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,765

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-

-

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Parana Technologies

USA . 377 parts In-Stock

1+ parts

-

100+ parts

$11.360

1k+ parts

-

10k+ parts

-

377

-

$11.360

-

-

Overview

Enhance your digital transmission interfaces with the ST5410 by STMicroelectronics. Designed with precision and quality in mind, this product offers unparalleled performance for a wide range of applications. From basic ISDN access rates to high-speed data transfer, this versatile telecom IC provides customers with reliable connectivity and seamless integration. Trust in STMicroelectronics' reputation for excellence and invest in the ST5410 for unbeatable value and benefits.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides durability and resistance to external elements, ensuring long-term reliability of the product.

Power Supplies (V): 5

The 5V power supply allows for compatibility with a wide range of systems and devices, making it versatile and easy to integrate.

No. of Terminals: 28

Having 28 terminals allows for complex connections and functionalities, making this product suitable for advanced digital transmission applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures stable performance even in demanding environments, providing reliability under various conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable in data transmission.

Data Rate: 0.144 Mbps

The data rate of 0.144 Mbps allows for efficient transmission of digital signals, ensuring fast and reliable communication.

Technical Specifications

Digital Transmission Interfaces ST5410 attributes and parameters. Explore more Digital Transmission Interfaces devices from STMicroelectronics

Specs

Data Rate:

.144 Mbps

ISDN Access Rate:

BASIC

JESD-30 Code:

R-GDIP-T28

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Output High Voltage:

2.4 V

Maximum Output Low Current:

1 Amp

Maximum Output Low Voltage:

.4 V

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Reference Point:

U

Maximum Seated Height:

5.71 mm

Standard:

ANSI T1.601

Sub-Category:

Digital Transmission Interfaces

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

ST5410 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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