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PSB3186FV1.4

Infineon Technologies

PSB3186FV1.4 by Infineon Technologies

ISDN CONTROLLER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE;

Median Price

$11.225

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 447 parts In-Stock

1+ parts

-

100+ parts

$11.810

1k+ parts

-

10k+ parts

-

447

-

$11.810

-

-

Rochester

USA . 447 parts In-Stock

1+ parts

-

100+ parts

$8.980

1k+ parts

$8.030

10k+ parts

$7.560

447

-

$8.980

$8.030

$7.560

Verical

USA . 53 parts In-Stock

1+ parts

-

100+ parts

$11.225

1k+ parts

$10.037

10k+ parts

$9.450

53

-

$11.225

$10.037

$9.450

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 559 parts In-Stock

1+ parts

$9.500

100+ parts

-

1k+ parts

-

10k+ parts

-

559

$9.500

-

-

-

Vyrian

USA . 318 parts In-Stock

1+ parts

$10.000

100+ parts

-

1k+ parts

-

10k+ parts

-

318

$10.000

-

-

-

LIBRA Elektronik GmbH

Germany . 1,439 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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1,439

-

-

-

-

DigiKey Marketplace

USA . 447 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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447

-

-

-

-

J2 Sourcing AB

Sweden . 120 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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120

-

-

-

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Connector Distribution Corp

USA . 20 parts In-Stock

1+ parts

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100+ parts

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20

-

-

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Right Parts Inc.

USA . 20 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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20

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 15 parts In-Stock

1+ parts

$9.000

100+ parts

-

1k+ parts

-

10k+ parts

-

15

$9.000

-

-

-

Modulus Dynamics

Lithuania . 132 parts In-Stock

1+ parts

$9.216

100+ parts

$8.847

1k+ parts

$8.479

10k+ parts

-

132

$9.216

$8.847

$8.479

-

Andel Nordic

Denmark . 391 parts In-Stock

1+ parts

$51.710

100+ parts

-

1k+ parts

$36.195

10k+ parts

$36.195

391

$51.710

-

$36.195

$36.195

A-Z Elektronik GmbH

Germany . 11,124 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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11,124

-

-

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,000

-

-

-

-

Kepictronics

USA . 970 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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970

-

-

-

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Microchip USA

USA . 181 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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181

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-

Technical Specifications

Digital Transmission Interfaces PSB3186FV1.4 attributes and parameters. Explore more Digital Transmission Interfaces devices from Infineon Technologies

Specs

Data Rate:

.144 Mbps

ISDN Access Rate:

BASIC

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Output High Voltage:

2.4 V

Maximum Output Low Current:

4.5 Amp

Maximum Output Low Voltage:

.45 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Reference Point:

S/T

Maximum Seated Height:

1.6 mm

Standard:

CCITT I.430

Sub-Category:

Digital Transmission Interfaces

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

PSB3186FV1.4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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