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MMBTH10LT3G

Onsemi

MMBTH10LT3G by Onsemi

MMBTH10LT3G by Onsemi is an NPN RF BJT with a max fT of 650 MHz, hFE of 60, and VCEO of 25V. Ideal for UHF applications due to its small outline package and high transition frequency. Suitable for surface mount designs requiring ultra-high frequency band performance.

Median Price

$0.070

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 160,000 parts In-Stock

1+ parts

$0.040

100+ parts

$0.040

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$0.040

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-

160,000

$0.040

$0.040

$0.040

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DigiKey

USA . 3,716 parts In-Stock

1+ parts

$0.100

100+ parts

$0.043

1k+ parts

$0.034

10k+ parts

$0.029

3,716

$0.100

$0.043

$0.034

$0.029

Distributors (In-Stock)

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Digiode

USA . 2,009 parts In-Stock

1+ parts

$0.256

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-

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2,009

$0.256

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Vyrian

USA . 635 parts In-Stock

1+ parts

$0.270

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-

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635

$0.270

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Flip Electronics

USA . 60,000 parts In-Stock

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60,000

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Chip Stock

USA . 24,000 parts In-Stock

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24,000

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Distributors (Availability)

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Ampacity Inc.

Singapore . 29,075 parts In-Stock

1+ parts

$0.230

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29,075

$0.230

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Corphita

USA . 1,100 parts In-Stock

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$0.243

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1,100

$0.243

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Component Stockers USA

USA . 21,316 parts In-Stock

1+ parts

$0.260

100+ parts

$0.070

1k+ parts

$0.050

10k+ parts

$0.030

21,316

$0.260

$0.070

$0.050

$0.030

Corohmni

South Africa . 406 parts In-Stock

1+ parts

$0.270

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406

$0.270

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QUARKTWIN TECHNOLOGY LTD

USA . 20,265 parts In-Stock

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20,265

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Kepictronics

USA . 20,000 parts In-Stock

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20,000

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Problanco Electronics

Mexico . 6,308 parts In-Stock

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6,308

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SupplyDigital Components

Austria . 6,014 parts In-Stock

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6,014

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Kulean Microsystems

USA . 4,558 parts In-Stock

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4,558

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TANS Electronics

Latvia . 2,365 parts In-Stock

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2,365

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UHIMA Technologies

Türkiye . 203 parts In-Stock

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203

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Overview

Unleash the power of innovation with the MMBTH10LT3G by Onsemi. Crafted with precision and expertise, this RF Small Signal Bipolar Junction Transistor (BJT) offers unparalleled performance in ultra-high frequency applications. With a single NPN configuration and a maximum power dissipation of 0.3 W, this transistor delivers reliable and efficient operation. Its small outline package and gull wing terminals make it easy to integrate into any design. Trust in Onsemi's reputation for quality and experience the benefits of superior technology with the MMBTH10LT3G. Elevate your projects to new heights with this cutting-edge component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers good insulation properties and is cost-effective, making it a reliable choice for the package body.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplifying and switching applications, making this product versatile and suitable for a wide range of electronic circuits.

Configuration: SINGLE

Single configuration simplifies circuit design and integration, making it easier to implement in various electronic projects.

Surface Mount: YES

Surface mount capability enables easy and efficient PCB assembly, saving space and reducing assembly time.

Maximum Power Dissipation (Abs): 0.3 W

With a maximum power dissipation of 0.3 W, this transistor can handle moderate power levels effectively without overheating.

Nominal Transition Frequency (fT): 650 MHz

The high nominal transition frequency of 650 MHz indicates good high-frequency performance, making it suitable for ultra-high-frequency applications.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) MMBTH10LT3G attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector-Base Capacitance:

.7 pF

Maximum Collector-Emitter Voltage:

25 V

Configuration:

Minimum DC Current Gain (hFE):

60

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-236

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

MMBTH10LT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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