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MC74VHCT86ADTR2G

Onsemi

MC74VHCT86ADTR2G by Onsemi

MC74VHCT86ADTR2G by Onsemi is a 4-function logic gate with 2 inputs, 10ns propagation delay at 3.3V. Ideal for applications requiring fast signal processing in compact designs due to its small outline package and low power consumption. Operating temperature range from -55°C to 85°C makes it suitable for various environments.

Median Price

$0.334

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,557 parts In-Stock

1+ parts

$0.340

100+ parts

$0.183

1k+ parts

$0.153

10k+ parts

$0.140

2,557

$0.340

$0.183

$0.153

$0.140

Mouser Electronics

USA . 2,522 parts In-Stock

1+ parts

$0.340

100+ parts

$0.183

1k+ parts

$0.154

10k+ parts

$0.135

2,522

$0.340

$0.183

$0.154

$0.135

Flip Electronics (Authorized)

USA . 67,500 parts In-Stock

1+ parts

-

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67,500

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Rochester

USA . 54,875 parts In-Stock

1+ parts

-

100+ parts

$0.329

1k+ parts

$0.273

10k+ parts

$0.243

54,875

-

$0.329

$0.273

$0.243

Verical

USA . 26,115 parts In-Stock

1+ parts

-

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-

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-

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$0.304

26,115

-

-

-

$0.304

Avnet

USA . 20,000 parts In-Stock

1+ parts

-

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-

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20,000

-

-

-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 793 parts In-Stock

1+ parts

$0.131

100+ parts

-

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-

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-

793

$0.131

-

-

-

Flip Electronics

USA . 115,000 parts In-Stock

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-

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115,000

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NAC Semi

USA . 32,500 parts In-Stock

1+ parts

-

100+ parts

-

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-

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$0.263

32,500

-

-

-

$0.263

Vyrian

USA . 2,825 parts In-Stock

1+ parts

-

100+ parts

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2,825

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Distributors (Availability)

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Corphita

USA . 303 parts In-Stock

1+ parts

$0.124

100+ parts

-

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-

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303

$0.124

-

-

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Corohmni

South Africa . 317 parts In-Stock

1+ parts

$0.235

100+ parts

-

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317

$0.235

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Kepictronics

USA . 10,859 parts In-Stock

1+ parts

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10,859

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TANS Electronics

Latvia . 7,920 parts In-Stock

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7,920

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SupplyDigital Components

Austria . 6,723 parts In-Stock

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6,723

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A-Z Elektronik GmbH

Germany . 6,605 parts In-Stock

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6,605

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Microchip USA

USA . 5,750 parts In-Stock

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5,750

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Problanco Electronics

Mexico . 3,413 parts In-Stock

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3,413

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Perfect Parts

USA . 2,645 parts In-Stock

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2,645

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Kulean Microsystems

USA . 2,524 parts In-Stock

1+ parts

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2,524

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UHIMA Technologies

Türkiye . 664 parts In-Stock

1+ parts

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664

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Overview

Experience unparalleled performance and reliability with the MC74VHCT86ADTR2G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality logic gates that excel in a variety of applications. With a wide range of functions, low propagation delay, and compact design, this product is a game-changer for your projects. Trust Onsemi to provide you with the best-in-class solutions that offer exceptional value, benefits, and advantages to meet all your needs. Elevate your work with the MC74VHCT86ADTR2G and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the logic gates, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 10 ns

Low propagation delay ensures fast signal processing and helps in improving the overall performance of the circuit.

Surface Mount: YES

Ease of installation and space-saving design make it suitable for compact electronic devices and PCBs.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a commonly used voltage level, making it compatible with a wide range of electronic systems and applications.

Maximum Operating Temperature: 85 °C

Can withstand higher temperatures, making it suitable for industrial and automotive applications where heat resistance is crucial.

Technical Specifications

Logic Gates MC74VHCT86ADTR2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHCT/VHCT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

10 ns

Propagation Delay (tpd):

16.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

MC74VHCT86ADTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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