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MC74VHCT157ADR2

Onsemi

MC74VHCT157ADR2 by Onsemi

MC74VHCT157ADR2 by Onsemi is a 4-function, 2-input multiplexer with 9.5ns propagation delay at 5V supply. It operates in the temperature range of -55 to 125 °C and has a max seated height of 1.75mm. Ideal for military-grade applications requiring high-speed signal switching in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 7,178 parts In-Stock

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R&J Components

USA . 2,500 parts In-Stock

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Digiode

USA . 1,742 parts In-Stock

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AZTECH Wire

Italy . 514 parts In-Stock

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Kulean Microsystems

USA . 7,807 parts In-Stock

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Problanco Electronics

Mexico . 6,706 parts In-Stock

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SupplyDigital Components

Austria . 5,741 parts In-Stock

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TANS Electronics

Latvia . 2,873 parts In-Stock

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Corphita

USA . 1,905 parts In-Stock

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Microchip USA

USA . 444 parts In-Stock

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Corohmni

South Africa . 429 parts In-Stock

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UHIMA Technologies

Türkiye . 126 parts In-Stock

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Overview

Discover the superior quality and reliability of the MC74VHCT157ADR2 by Onsemi, a leading manufacturer in the industry. This multiplexer/demultiplexer offers unmatched performance and efficiency for various applications. With a compact design and advanced technology, this product provides customers with seamless integration and optimal functionality. Experience the value and benefits of Onsemi's MC74VHCT157ADR2, ensuring top-notch performance and reliability for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 9.5 ns

The low propagation delay ensures fast and efficient signal processing, making this multiplexer/demultiplexer suitable for high-speed applications.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation on PCBs, saving space and simplifying the manufacturing process.

No. of Functions: 4

Having 4 functions in one device increases efficiency and reduces the need for multiple components, saving cost and board space.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common 5V supply voltage makes integration with other components straightforward, and ensures compatibility with standard power sources.

Output Characteristics: 3-STATE

The 3-STATE output allows for a high degree of flexibility in controlling the output signals, enhancing the versatility of the product.

Technology: CMOS

The CMOS technology used in this product provides low power consumption and high noise immunity, making it suitable for battery-powered devices and noise-sensitive environments.

Technical Specifications

Multiplexer & Demultiplexer MC74VHCT157ADR2 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

AHCT/VHCT

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

235

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

9.5 ns

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

MC74VHCT157ADR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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