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MC74VHC1GT86DT1G

Onsemi

MC74VHC1GT86DT1G by Onsemi

MC74VHC1GT86DT1G by Onsemi is a logic gate with 2 inputs, 12 ns propagation delay, and 19.5 ns tpd. It operates at 3.3/5 V, has a small outline package style, and is suitable for military-grade applications requiring fast signal processing in compact spaces.

Median Price

$0.064

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 30,500 parts In-Stock

1+ parts

-

100+ parts

$0.066

1k+ parts

$0.055

10k+ parts

$0.049

30,500

-

$0.066

$0.055

$0.049

Verical

USA . 30,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.061

30,500

-

-

-

$0.061

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,200 parts In-Stock

1+ parts

$0.051

100+ parts

-

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1,200

$0.051

-

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Vyrian

USA . 3,039 parts In-Stock

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3,039

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Distributors (Availability)

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Corphita

USA . 215 parts In-Stock

1+ parts

$0.049

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-

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215

$0.049

-

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Corohmni

South Africa . 100 parts In-Stock

1+ parts

$0.054

100+ parts

-

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100

$0.054

-

-

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AZTECH Wire

Italy . 191 parts In-Stock

1+ parts

$8.200

100+ parts

-

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191

$8.200

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Continental Prestige Electronics

USA . 30,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.047

10k+ parts

-

30,500

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-

$0.047

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QUARKTWIN TECHNOLOGY LTD

USA . 13,406 parts In-Stock

1+ parts

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13,406

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SupplyDigital Components

Austria . 7,650 parts In-Stock

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7,650

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Kulean Microsystems

USA . 6,700 parts In-Stock

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6,700

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Problanco Electronics

Mexico . 5,989 parts In-Stock

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5,989

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Microchip USA

USA . 3,981 parts In-Stock

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3,981

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UHIMA Technologies

Türkiye . 885 parts In-Stock

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885

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TANS Electronics

Latvia . 205 parts In-Stock

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205

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Overview

Discover the MC74VHC1GT86DT1G by Onsemi, a high-quality logic gate that offers superior performance and reliability. Manufactured by Onsemi, a trusted leader in semiconductor technology, this product is designed for a wide range of applications. With a fast propagation delay and low power consumption, this logic gate provides efficient operation at a nominal supply voltage of 3.3V. Its compact size and surface mount package make it ideal for space-constrained designs. Experience the value and benefits of the MC74VHC1GT86DT1G - elevate your projects with precision and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring it can hold up well in various applications.

Propagation Delay At Nominal Supply: 12 ns

The low propagation delay of 12 ns ensures efficient and quick signal processing, making this product suitable for high-speed applications.

Surface Mount: YES

The surface mount feature allows for easy installation on PCBs, saving space and making the product convenient to integrate into electronic systems.

No. of Inputs: 2

Having 2 inputs provides flexibility in designing logic circuits, allowing for more complex operations to be carried out.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V is commonly used in many electronic devices, ensuring compatibility with a wide range of applications.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Technical Specifications

Logic Gates MC74VHC1GT86DT1G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

12 ns

Propagation Delay (tpd):

19.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.5 mm

Trade Compliance

MC74VHC1GT86DT1G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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