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MC74VHC1GT08P5T5G-L22088

Onsemi

MC74VHC1GT08P5T5G-L22088 by Onsemi

MC74VHC1GT08P5T5G-L22088 by Onsemi is a Logic Gate with 2 inputs, 16.5 ns propagation delay, and 3V nominal voltage. Ideal for applications requiring fast signal processing in compact designs with surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,154 parts In-Stock

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Digiode

USA . 2,045 parts In-Stock

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Microchip USA

USA . 9,134 parts In-Stock

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$0.386

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AZTECH Wire

Italy . 1,075 parts In-Stock

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$8.480

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TANS Electronics

Latvia . 4,062 parts In-Stock

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Kulean Microsystems

USA . 2,771 parts In-Stock

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Corphita

USA . 2,279 parts In-Stock

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UHIMA Technologies

Türkiye . 988 parts In-Stock

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SupplyDigital Components

Austria . 533 parts In-Stock

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Problanco Electronics

Mexico . 523 parts In-Stock

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Corohmni

South Africa . 146 parts In-Stock

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Overview

Enhance your electronic projects with the MC74VHC1GT08P5T5G-L22088 logic gate from Onsemi. Known for their high-quality components, Onsemi delivers reliable solutions for a wide range of applications. This compact and efficient logic gate offers fast propagation delay, low power consumption, and 3-state output characteristics. Whether you're working on consumer electronics, industrial automation, or telecommunications, this versatile component provides the performance and value you need to bring your designs to life. Upgrade your projects with the MC74VHC1GT08P5T5G-L22088 and experience the benefits of Onsemi's trusted technology.

Feature Benefit Bullets

Propagation Delay At Nominal Supply 16.5 ns

Low propagation delay ensures rapid signal processing, making this product suitable for high-speed applications.

Surface Mount YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and effort during production.

No. of Inputs 2

Having 2 inputs allows for versatile logic operations and enables more complex circuit designs.

Nominal Supply Voltage / Vsup (V) 3

Operating at a standard supply voltage of 3V makes this product compatible with common power sources.

Load Capacitance (CL) 50 pF

The low load capacitance minimizes the impact on signal integrity and ensures reliable performance in various circuit configurations.

Package Style (Meter) SMALL OUTLINE, VERY THIN PROFILE

The small outline and thin profile package saves space on the PCB and allows for compact designs in constrained environments.

Output Characteristics 3-STATE

The 3-state output feature provides additional flexibility in controlling signal transmission, enhancing the versatility of the device.

Technology CMOS

Complementary Metal-Oxide-Semiconductor technology offers low power consumption and high noise immunity, contributing to efficient and reliable operation.

Technical Specifications

Logic Gates MC74VHC1GT08P5T5G-L22088 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-XDSO-F5

Length:

1 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

FL5/6,.03,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay At Nominal Supply:

16.5 ns

Propagation Delay (tpd):

16.5 ns

Schmitt Trigger:

NO

Maximum Seated Height:

.4 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Width:

.8 mm

Trade Compliance

MC74VHC1GT08P5T5G-L22088 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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