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MC74VHC1GT00DT1G

Onsemi

MC74VHC1GT00DT1G by Onsemi

MC74VHC1GT00DT1G by Onsemi is a Logic Gate with 2 inputs, 10.5 ns propagation delay, and 17.5 ns tpd. It operates at temperatures from -55 to 125 °C and supports power supplies of 3.3/5 V. Ideal for military-grade applications requiring fast signal processing in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,095 parts In-Stock

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Digiode

USA . 579 parts In-Stock

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AZTECH Wire

Italy . 674 parts In-Stock

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$12.180

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Component Stockers USA

USA . 403 parts In-Stock

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$99.990

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TANS Electronics

Latvia . 6,821 parts In-Stock

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Problanco Electronics

Mexico . 2,849 parts In-Stock

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SupplyDigital Components

Austria . 1,790 parts In-Stock

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Corphita

USA . 544 parts In-Stock

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Microchip USA

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Kulean Microsystems

USA . 417 parts In-Stock

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UHIMA Technologies

Türkiye . 298 parts In-Stock

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Corohmni

South Africa . 281 parts In-Stock

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Overview

Experience the exceptional quality and reliability of Onsemi with the MC74VHC1GT00DT1G logic gate. Perfect for a wide range of applications, this small outline, thin profile package offers fast propagation delay and dual terminal position for easy installation. With a maximum supply voltage of 5.5V and peak reflow temperature of 260 °C, this military-grade technology provides superior performance in extreme conditions. Trust Onsemi to deliver cutting-edge solutions that exceed your expectations. Choose the MC74VHC1GT00DT1G for unmatched value and benefits in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material makes the product lightweight and durable.

Propagation Delay At Nominal Supply: 10.5 ns

Low propagation delay ensures quick signal processing, making this product efficient for time-sensitive applications.

Surface Mount: YES

Surface mount capability allows for easier and more efficient PCB mounting, saving space and reducing assembly time.

No. of Inputs: 2

Having 2 inputs provides flexibility in logic operations and can accommodate various input scenarios.

Power Supplies (V): 3.3/5

Support for multiple power supply voltages allows for compatibility with different systems and power requirements.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

The small outline and thin profile design save space on the PCB, making it suitable for compact electronic devices.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability in various environments, especially in industrial or outdoor settings.

Minimum Operating Temperature: -55 °C

Wide range of operating temperatures allows for usage in extreme cold environments without compromising performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Logic Gates MC74VHC1GT00DT1G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

17.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Trade Compliance

MC74VHC1GT00DT1G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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