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MC74LVX50DTR2

Onsemi

MC74LVX50DTR2 by Onsemi

MC74LVX50DTR2 by Onsemi is a logic gate with 6 functions, 11.5 ns propagation delay at 3.3V, and 50pF load capacitance. It is used in industrial applications for signal processing due to its CMOS technology and small outline package style.

Median Price

$0.089

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 18,564 parts In-Stock

1+ parts

-

100+ parts

$0.092

1k+ parts

$0.077

10k+ parts

$0.068

18,564

-

$0.092

$0.077

$0.068

Verical

USA . 17,500 parts In-Stock

1+ parts

-

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-

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10k+ parts

$0.086

17,500

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-

-

$0.086

Distributors (In-Stock)

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Digiode

USA . 877 parts In-Stock

1+ parts

$0.072

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-

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877

$0.072

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Vyrian

USA . 5,678 parts In-Stock

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5,678

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Distributors (Availability)

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Ampacity Inc.

Singapore . 18,048 parts In-Stock

1+ parts

$0.061

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-

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18,048

$0.061

-

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Corphita

USA . 1,066 parts In-Stock

1+ parts

$0.068

100+ parts

-

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1,066

$0.068

-

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Corohmni

South Africa . 191 parts In-Stock

1+ parts

$0.072

100+ parts

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191

$0.072

-

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AZTECH Wire

Italy . 1,119 parts In-Stock

1+ parts

$16.230

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1,119

$16.230

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Continental Prestige Electronics

USA . 18,564 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.064

10k+ parts

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18,564

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$0.064

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Kulean Microsystems

USA . 7,089 parts In-Stock

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7,089

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A-Z Elektronik GmbH

Germany . 6,806 parts In-Stock

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6,806

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Microchip USA

USA . 5,254 parts In-Stock

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TANS Electronics

Latvia . 4,697 parts In-Stock

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4,697

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SupplyDigital Components

Austria . 4,492 parts In-Stock

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4,492

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RC Electronics

USA . 3,600 parts In-Stock

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3,600

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Problanco Electronics

Mexico . 2,807 parts In-Stock

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2,807

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UHIMA Technologies

Türkiye . 397 parts In-Stock

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397

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Overview

Elevate your projects with the MC74LVX50DTR2 by Onsemi, a top-tier manufacturer known for quality and innovation in the Logic Gates category. This versatile component offers lightning-fast 11.5 ns propagation delay, making it ideal for applications that demand precision and efficiency. With a compact design and a wide temperature range, this product provides unmatched reliability and performance. Trust Onsemi to deliver superior products that bring value and benefits to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the logic gates, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 11.5 ns

Low propagation delay ensures fast response times, making these logic gates ideal for applications requiring quick processing.

Surface Mount: YES

Surface mount capability makes installation of these logic gates easy and efficient, saving time and effort during assembly.

No. of Functions: 6

Having multiple functions in one package increases the versatility and functionality of these logic gates, allowing for a variety of applications.

Nominal Supply Voltage / Vsup (V): 2.7

Operating at a nominal supply voltage of 2.7V makes these logic gates energy efficient, saving power and reducing operating costs.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF ensures stable and reliable performance of the logic gates, even in high capacitance environments.

Power Supplies (V): 3.3

Supporting power supplies up to 3.3V provides flexibility in voltage requirements, making these logic gates compatible with a wide range of systems.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, these logic gates can withstand high temperatures, making them suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Operating at temperatures as low as -40 °C ensures reliable performance in cold environments, enhancing the versatility of these logic gates.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making these logic gates reliable and energy efficient.

Technical Specifications

Logic Gates MC74LVX50DTR2 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

11.5 ns

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

MC74LVX50DTR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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