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MC74HCT32ADG

Onsemi

MC74HCT32ADG by Onsemi

MC74HCT32ADG by Onsemi is a 4-function logic gate with 2 inputs. It operates at a nominal voltage of 5V and has a propagation delay of 22ns. Suitable for applications requiring fast signal processing in military-grade environments.

Median Price

$0.220

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 805 parts In-Stock

1+ parts

$0.121

100+ parts

$0.061

1k+ parts

$0.059

10k+ parts

-

805

$0.121

$0.061

$0.059

-

Mouser Electronics

USA . 27 parts In-Stock

1+ parts

$0.570

100+ parts

-

1k+ parts

$0.248

10k+ parts

$0.200

27

$0.570

-

$0.248

$0.200

DigiKey

USA . 138 parts In-Stock

1+ parts

$0.990

100+ parts

$0.424

1k+ parts

$0.373

10k+ parts

-

138

$0.990

$0.424

$0.373

-

Adafruit Industries

USA . 5,000 parts In-Stock

1+ parts

$23.206

100+ parts

$21.117

1k+ parts

$19.029

10k+ parts

-

5,000

$23.206

$21.117

$19.029

-

Flip Electronics (Authorized)

USA . 36,480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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36,480

-

-

-

-

Rochester

USA . 25,280 parts In-Stock

1+ parts

-

100+ parts

$0.132

1k+ parts

$0.110

10k+ parts

$0.098

25,280

-

$0.132

$0.110

$0.098

Verical

USA . 25,245 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.122

25,245

-

-

-

$0.122

Chip1Stop

Japan . 795 parts In-Stock

1+ parts

-

100+ parts

$0.220

1k+ parts

$0.146

10k+ parts

-

795

-

$0.220

$0.146

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,142 parts In-Stock

1+ parts

$0.141

100+ parts

-

1k+ parts

-

10k+ parts

-

1,142

$0.141

-

-

-

Flip Electronics

USA . 36,480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

36,480

-

-

-

-

Vyrian

USA . 4,019 parts In-Stock

1+ parts

-

100+ parts

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4,019

-

-

-

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Bristol Electronics

USA . 2,475 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,475

-

-

-

-

Dan-Mar Components

USA . 2,475 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,475

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 269 parts In-Stock

1+ parts

$0.133

100+ parts

-

1k+ parts

-

10k+ parts

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269

$0.133

-

-

-

Corohmni

South Africa . 152 parts In-Stock

1+ parts

$0.148

100+ parts

-

1k+ parts

-

10k+ parts

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152

$0.148

-

-

-

Microchip USA

USA . 216 parts In-Stock

1+ parts

$4.030

100+ parts

$4.010

1k+ parts

$3.990

10k+ parts

$3.980

216

$4.030

$4.010

$3.990

$3.980

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$23.206

100+ parts

$21.117

1k+ parts

$19.029

10k+ parts

-

5,000

$23.206

$21.117

$19.029

-

Continental Prestige Electronics

USA . 25,280 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.159

10k+ parts

-

25,280

-

-

$0.159

-

Perfect Parts

USA . 6,041 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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6,041

-

-

-

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Problanco Electronics

Mexico . 5,238 parts In-Stock

1+ parts

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5,238

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-

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TANS Electronics

Latvia . 4,137 parts In-Stock

1+ parts

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4,137

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-

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SupplyDigital Components

Austria . 3,503 parts In-Stock

1+ parts

-

100+ parts

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3,503

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-

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UHIMA Technologies

Türkiye . 347 parts In-Stock

1+ parts

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347

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Kulean Microsystems

USA . 147 parts In-Stock

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147

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Overview

Boost your electronic projects with the MC74HCT32ADG logic gates from Onsemi! Manufactured with top-quality plastic/epoxy material, these versatile components offer fast propagation delay and reliable performance. With 4 functions and 2 inputs, this rectangular-shaped package is perfect for a wide range of applications. Whether you're designing a new circuit or upgrading an existing system, the MC74HCT32ADG provides value, efficiency, and innovation that customers can trust. Experience the benefits of Onsemi's cutting-edge technology and elevate your projects to the next level!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and resistance to environmental factors, making the product reliable for various applications.

Propagation Delay At Nominal Supply: 22 ns

Low propagation delay ensures fast signal processing, making the product suitable for high-speed logic operations.

Surface Mount: YES

Surface mount capability saves space on PCBs and facilitates automated assembly, enhancing efficiency and reducing production costs.

No. of Functions: 4

Having 4 functions in a single package increases integration and simplifies circuit design, saving board space and reducing component count.

No. of Inputs: 2

The 2 input configuration allows for basic logic operations and can be easily integrated into various digital circuits.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage commonly used in digital systems, ensuring compatibility with existing designs.

Load Capacitance (CL): 50 pF

Suitable load capacitance ensures stable performance in different load conditions, making the product versatile for various applications.

Maximum Operating Temperature: 125 °C

High operating temperature range allows for reliability in harsh environments and extended product lifespan.

Minimum Operating Temperature: -55 °C

Wide temperature range ensures functionality in extreme cold conditions, making the product suitable for diverse environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Technical Specifications

Logic Gates MC74HCT32ADG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

22 ns

Propagation Delay (tpd):

22 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC74HCT32ADG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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