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MC74HC132ANG

Onsemi

MC74HC132ANG by Onsemi

MC74HC132ANG by Onsemi is a CMOS logic gate with 4 functions and 2 inputs. It has a propagation delay of 38 ns at 5V supply, suitable for military-grade applications. The package is rectangular in shape, with through-hole terminals and Schmitt trigger technology.

Median Price

$15.034

Lifecycle Status

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11

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1k+

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Adafruit Industries

USA . 10 parts In-Stock

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$15.034

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$13.681

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$12.328

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10

$15.034

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$12.328

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Nova Conductors

Japan . 66 parts In-Stock

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$0.303

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66

$0.303

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Component Electronics Inc.

Canada . 3 parts In-Stock

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$1.540

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$1.150

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$1.000

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$1.540

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Digiode

USA . 1,903 parts In-Stock

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$14.282

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Vyrian

USA . 6,521 parts In-Stock

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Sensible Micro Corp

USA . 190 parts In-Stock

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$0.215

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Bristol Electronics

USA . 25 parts In-Stock

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Inventory MP

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North Shore Components

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Lantek

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Atlantic Semiconductor

USA . 6 parts In-Stock

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Corohmni

South Africa . 323 parts In-Stock

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$0.215

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323

$0.215

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Ampacity Inc.

Singapore . 10 parts In-Stock

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$12.780

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Corphita

USA . 2,196 parts In-Stock

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$13.531

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Advanced Electronics

New Zealand . 10 parts In-Stock

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$15.034

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$13.681

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$12.328

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10

$15.034

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$12.328

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AZTECH Wire

Italy . 500 parts In-Stock

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$16.150

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QUARKTWIN TECHNOLOGY LTD

USA . 27,496 parts In-Stock

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Kulean Microsystems

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Problanco Electronics

Mexico . 5,752 parts In-Stock

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Microchip USA

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SupplyDigital Components

Austria . 3,244 parts In-Stock

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S.R.D Solutions

India . 2,500 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$0.297

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$0.288

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$0.282

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Kepictronics

USA . 1,950 parts In-Stock

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Metaverse IC Inc.

Canada . 1,950 parts In-Stock

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TANS Electronics

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UHIMA Technologies

Türkiye . 887 parts In-Stock

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GreenTree Electronics

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Overview

Enhance your electronic projects with the MC74HC132ANG by Onsemi, a high-quality logic gate that offers unparalleled performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this product is designed to meet the most demanding requirements of any application. With its fast propagation delay and 3-state output characteristics, the MC74HC132ANG ensures optimal functionality and efficiency. Whether you're a hobbyist or a professional, this logic gate will elevate your designs to the next level. Experience the value and benefits of Onsemi's MC74HC132ANG today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable applications.

Propagation Delay At Nominal Supply: 38 ns

With a fast propagation delay, this logic gate ensures quick and efficient signal processing, making it suitable for high-speed applications.

No. of Functions: 4

Offering multiple functions in one package maximizes efficiency and saves space on a circuit board.

No. of Inputs: 2

With 2 inputs, this logic gate can perform basic logical operations, making it versatile for a variety of applications.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy integration into circuit designs and PCB layouts.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V, this logic gate is compatible with most systems and can easily be powered.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF ensures stable and reliable signal transmission, making this logic gate a dependable choice for critical applications.

Power Supplies (V): 2/6

Supporting power supplies of 2V to 6V, this logic gate is versatile and can be used in a wide range of systems.

No. of Terminals: 14

The 14 terminals provide ample connectivity options, allowing for easy integration into complex circuits.

Package Style (Meter): IN-LINE

The in-line package style saves space on a PCB and allows for easy placement alongside other components.

Maximum I (ol): 4 Amp

With a maximum output current of 4 Amps, this logic gate can drive high-power components, making it suitable for demanding applications.

Propagation Delay (tpd): 190 ns

While not the fastest, a propagation delay of 190 ns is still quick enough for most applications, striking a balance between speed and power consumption.

Maximum Operating Temperature: 125 °C

Operating up to 125°C, this logic gate is suitable for use in high-temperature environments, ensuring reliability in challenging conditions.

Output Characteristics: 3-STATE

The 3-state output characteristics allow for high impedance when disabled, reducing power consumption and increasing design flexibility.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55°C, this logic gate is suitable for use in cold environments or applications requiring a wide temperature range.

Terminal Finish: Tin (Sn)

The tin terminal finish provides corrosion resistance and ensures reliable connections, extending the lifespan of the product.

Terminal Position: DUAL

With dual terminal positions, this logic gate offers flexibility in circuit layout and can accommodate different mounting configurations.

Maximum Seated Height: 4.69 mm

The compact seated height of 4.69 mm allows for low-profile installations, making this logic gate suitable for space-constrained applications.

Width: 7.62 mm

At a width of 7.62 mm, this logic gate is compact and can be easily integrated into densely packed circuit designs.

Minimum Supply Voltage (Vsup): 2 V

With a minimum supply voltage of 2V, this logic gate can operate in low-power conditions, making it energy-efficient.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time of 40 seconds at peak reflow temperature ensures reliable soldering and long-term durability.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this logic gate can withstand high-temperature soldering processes, ensuring proper assembly.

Length: 18.86 mm

The length of 18.86 mm provides a compact footprint, making this logic gate suitable for applications with limited space.

Temperature Grade: MILITARY

Designed for military-grade applications, this logic gate meets stringent quality and reliability standards, making it a reliable choice for demanding environments.

Schmitt Trigger: YES

With a Schmitt trigger, this logic gate offers hysteresis for noise immunity, ensuring reliable operation in noisy environments.

Technology: CMOS

Using CMOS technology, this logic gate offers low power consumption and high noise immunity, making it suitable for battery-powered devices and noise-sensitive applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides secure connections and ease of soldering, making this logic gate suitable for rugged applications.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54 mm, this logic gate is compatible with standard PCB layouts, making it easy to integrate into existing designs.

Maximum Supply Voltage (Vsup): 6 V

Supporting a maximum supply voltage of 6V, this logic gate has a wide voltage range and can be used in various systems with different power requirements.

Technical Specifications

Logic Gates MC74HC132ANG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e3

Length:

18.86 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

38 ns

Propagation Delay (tpd):

190 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

4.69 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.62 mm

Trade Compliance

MC74HC132ANG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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