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MC74HC04AF

Onsemi

MC74HC04AF by Onsemi

MC74HC04AF by Onsemi is a CMOS Logic Gates IC with 6 functions, 22ns propagation delay at 3V. It operates b/w -55 to 125 °C and has a peak reflow temp of 260 °C. Ideal for military-grade applications requiring fast signal processing in compact spaces.

Median Price

$0.159

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 168 parts In-Stock

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-

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$0.159

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$0.132

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$0.117

168

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$0.159

$0.132

$0.117

Distributors (In-Stock)

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Digiode

USA . 1,340 parts In-Stock

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$0.124

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Vyrian

USA . 6,264 parts In-Stock

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Manotoh

Italy . 5,195 parts In-Stock

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Corphita

USA . 737 parts In-Stock

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$0.117

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Corohmni

South Africa . 379 parts In-Stock

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$0.130

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AZTECH Wire

Italy . 481 parts In-Stock

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$17.700

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QUARKTWIN TECHNOLOGY LTD

USA . 15,760 parts In-Stock

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Kulean Microsystems

USA . 7,558 parts In-Stock

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RC Electronics

USA . 5,000 parts In-Stock

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TANS Electronics

Latvia . 4,980 parts In-Stock

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Problanco Electronics

Mexico . 1,192 parts In-Stock

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UHIMA Technologies

Türkiye . 596 parts In-Stock

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Microchip USA

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SupplyDigital Components

Austria . 465 parts In-Stock

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Overview

Looking for high-quality logic gates for your next project? Look no further than the MC74HC04AF by Onsemi. With a reputation for reliability and precision, Onsemi delivers top-notch products that meet the highest industry standards. The MC74HC04AF is perfect for applications requiring fast signal propagation and low power consumption. Its compact design and surface mount capability make it easy to integrate into any project. Trust Onsemi to provide you with the tools you need to succeed. Choose the MC74HC04AF for unmatched performance and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for a wide range of applications

Propagation Delay At Nominal Supply: 22 ns

Fast response time, ideal for high-speed applications

Surface Mount: YES

Ease of installation and space-saving design

Nominal Supply Voltage / Vsup (V): 3

Optimal voltage for efficient operation

Load Capacitance (CL): 50 pF

Suitable for handling various loads and maintaining stability

Power Supplies (V): 2/6

Versatile voltage range for flexibility in different applications

No. of Terminals: 14

Sufficient number of terminals for connectivity options

Maximum I (ol): 4 Amp

High output current capability for driving external loads

Maximum Operating Temperature: 125 °C

Can operate in high-temperature environments without malfunctioning

Minimum Operating Temperature: -55 °C

Can operate in low-temperature environments without damage

Technology: CMOS

Low power consumption and high noise immunity

Technical Specifications

Logic Gates MC74HC04AF attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

22 ns

Propagation Delay (tpd):

110 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.05 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74HC04AF Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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