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MC74ACT257MEL

Onsemi

MC74ACT257MEL by Onsemi

MC74ACT257MEL by Onsemi is a 4-function, 2-input multiplexer with 8.5ns propagation delay at 5V supply. It features a small outline package, operates in industrial temperature range (-40 to 85 °C), and has a max seated height of 2.05mm. Ideal for applications requiring fast switching and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,425 parts In-Stock

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Digiode

USA . 1,090 parts In-Stock

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1,090

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AZTECH Wire

Italy . 83 parts In-Stock

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$8.920

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83

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QUARKTWIN TECHNOLOGY LTD

USA . 13,380 parts In-Stock

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Kulean Microsystems

USA . 7,711 parts In-Stock

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Problanco Electronics

Mexico . 2,618 parts In-Stock

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SupplyDigital Components

Austria . 1,630 parts In-Stock

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Corphita

USA . 797 parts In-Stock

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UHIMA Technologies

Türkiye . 667 parts In-Stock

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TANS Electronics

Latvia . 550 parts In-Stock

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Microchip USA

USA . 494 parts In-Stock

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Corohmni

South Africa . 138 parts In-Stock

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Overview

Discover the MC74ACT257MEL by Onsemi, a top-quality multiplexer & demultiplexer that offers exceptional performance and reliability. With a wide range of applications, this product is designed to meet the needs of various industries. Onsemi's reputation for innovation and cutting-edge technology ensures that customers receive a high-value solution that delivers superior results. Experience the benefits of fast propagation delay, 3-state output characteristics, and a compact package design that make the MC74ACT257MEL a standout choice for your next project. Trust Onsemi to provide top-of-the-line components that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight, durable, and cost-effective, making the product easy to handle and transport.

Propagation Delay At Nominal Supply: 8.5 ns

Low propagation delay ensures fast and efficient signal processing, ideal for applications requiring quick response times.

No. of Functions: 4

Having 4 functions in one device increases efficiency and saves space in circuit design.

No. of Inputs: 2

With 2 inputs, the product allows for versatile signal routing, enabling various configurations.

Nominal Supply Voltage / Vsup (V): 5

Operating at 5V supply voltage is common in many electronic systems, ensuring compatibility with standard power sources.

Maximum Operating Temperature: 85 °C

With an operating temperature range up to 85 °C, the product is suitable for industrial environments with higher temperature requirements.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, resulting in efficient operation and reliable signal processing.

Technical Specifications

Multiplexer & Demultiplexer MC74ACT257MEL attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

ACT

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

8.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74ACT257MEL Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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