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MC74ACT20DG

Onsemi

MC74ACT20DG by Onsemi

MC74ACT20DG by Onsemi is a logic gate with 2 functions and 4 inputs. It has a propagation delay of 10.5 ns at 5V, making it suitable for industrial applications requiring fast signal processing. This small outline package with matte tin finish operates b/w -40 to 85 °C, ideal for compact electronic designs.

Median Price

$0.453

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 55 parts In-Stock

1+ parts

$0.590

100+ parts

$0.346

1k+ parts

$0.289

10k+ parts

$0.260

55

$0.590

$0.346

$0.289

$0.260

Mouser Electronics

USA . 4 parts In-Stock

1+ parts

$0.590

100+ parts

$0.347

1k+ parts

$0.289

10k+ parts

$0.247

4

$0.590

$0.347

$0.289

$0.247

Rochester

USA . 84,911 parts In-Stock

1+ parts

-

100+ parts

$0.316

1k+ parts

$0.262

10k+ parts

$0.234

84,911

-

$0.316

$0.262

$0.234

Verical

USA . 44,426 parts In-Stock

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-

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$0.292

44,426

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-

-

$0.292

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 307 parts In-Stock

1+ parts

$0.245

100+ parts

-

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307

$0.245

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Flip Electronics

USA . 64,295 parts In-Stock

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-

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64,295

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Vyrian

USA . 6,532 parts In-Stock

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6,532

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 238 parts In-Stock

1+ parts

$0.225

100+ parts

-

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-

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238

$0.225

-

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Corphita

USA . 2,250 parts In-Stock

1+ parts

$0.232

100+ parts

-

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2,250

$0.232

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Continental Prestige Electronics

USA . 40,485 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.360

10k+ parts

-

40,485

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-

$0.360

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Kepictronics

USA . 14,670 parts In-Stock

1+ parts

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14,670

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QUARKTWIN TECHNOLOGY LTD

USA . 8,182 parts In-Stock

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8,182

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Problanco Electronics

Mexico . 7,313 parts In-Stock

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7,313

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Kulean Microsystems

USA . 6,718 parts In-Stock

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6,718

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TANS Electronics

Latvia . 4,987 parts In-Stock

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4,987

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SupplyDigital Components

Austria . 3,383 parts In-Stock

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3,383

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Perfect Parts

USA . 1,990 parts In-Stock

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1,990

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UHIMA Technologies

Türkiye . 823 parts In-Stock

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823

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Overview

Elevate your electronic projects with the MC74ACT20DG by Onsemi, a high-quality logic gate that delivers exceptional performance and reliability. Manufactured by Onsemi, a trusted name in semiconductor technology, this product offers a wide range of applications in digital electronics. With its fast propagation delay and low power consumption, the MC74ACT20DG provides customers with value and efficiency. Whether you're designing consumer electronics or industrial control systems, this logic gate is the perfect choice for your project. Experience the benefits of Onsemi's cutting-edge technology with the MC74ACT20DG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product reliable for long-term use.

Propagation Delay At Nominal Supply: 10.5 ns

Low propagation delay ensures fast response and efficient operation of the logic gates.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 5

Operates at a common supply voltage, making it compatible with various systems.

Load Capacitance (CL): 50 pF

Optimal load capacitance for reliable performance and signal integrity.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Technical Specifications

Logic Gates MC74ACT20DG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

ACT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

4

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC74ACT20DG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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