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MC74AC02DTR2

Onsemi

MC74AC02DTR2 by Onsemi

MC74AC02DTR2 by Onsemi is a CMOS Logic Gates IC with 4 functions, 2 inputs, and 8ns propagation delay at 5V. It operates in industrial temperature range (-40 to 85°C) and supports power supplies of 3.3/5V. Ideal for applications requiring fast signal processing in compact designs.

Median Price

$0.119

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 125,000 parts In-Stock

1+ parts

-

100+ parts

$0.119

1k+ parts

$0.099

10k+ parts

$0.088

125,000

-

$0.119

$0.099

$0.088

DigiKey

USA . 125,000 parts In-Stock

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$0.150

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$0.150

Verical

USA . 125,000 parts In-Stock

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$0.110

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$0.110

Distributors (In-Stock)

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$0.087

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500

$0.087

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Digiode

USA . 725 parts In-Stock

1+ parts

$0.093

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725

$0.093

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Vyrian

USA . 8,037 parts In-Stock

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8,037

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Inventory MP

USA . 720 parts In-Stock

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720

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Bristol Electronics

USA . 720 parts In-Stock

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720

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Cyclops Electronics Ltd

UK . 250 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 124,657 parts In-Stock

1+ parts

$0.083

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$0.083

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Corphita

USA . 2,133 parts In-Stock

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$0.088

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Corohmni

South Africa . 495 parts In-Stock

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$0.098

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495

$0.098

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AZTECH Wire

Italy . 854 parts In-Stock

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$8.730

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854

$8.730

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Continental Prestige Electronics

USA . 125,000 parts In-Stock

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$0.085

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$0.085

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TANS Electronics

Latvia . 8,010 parts In-Stock

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SupplyDigital Components

Austria . 5,826 parts In-Stock

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Problanco Electronics

Mexico . 4,621 parts In-Stock

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Kulean Microsystems

USA . 2,851 parts In-Stock

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Microchip USA

USA . 376 parts In-Stock

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UHIMA Technologies

Türkiye . 269 parts In-Stock

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Overview

Enhance your electronic projects with the MC74AC02DTR2 by Onsemi, a high-quality logic gate designed to deliver reliable performance. Manufactured by Onsemi, a trusted name in the industry, this product offers fast propagation delay and multiple functions in a compact package. Ideal for a wide range of applications, this logic gate provides customers with exceptional value, efficiency, and precision. Upgrade your circuits today with the MC74AC02DTR2 and experience the benefits of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the logic gates, making them suitable for various operating environments.

Propagation Delay At Nominal Supply: 8 ns

The low propagation delay of 8ns ensures fast signal processing, making these logic gates suitable for applications where speed is crucial.

No. of Inputs: 2

Having 2 inputs allows for flexibility in designing logical operations, providing versatility in various circuit configurations.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V is a common standard in electronic circuits, making these logic gates compatible with many existing systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, these logic gates can withstand elevated temperatures, making them suitable for industrial applications.

Technical Specifications

Logic Gates MC74AC02DTR2 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AC

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

8 ns

Propagation Delay (tpd):

8 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

MC74AC02DTR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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