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MC14011BFELG

Onsemi

MC14011BFELG by Onsemi

MC14011BFELG by Onsemi is a CMOS Logic Gates IC with 4 functions and 2 inputs. It operates at 5V, has a propagation delay of 250ns, and can withstand temperatures from -55 to 125°C. Ideal for military applications due to its small outline package and nickel palladium gold terminal finish.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

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Digiode

USA . 1,738 parts In-Stock

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Nova Conductors

Japan . 600 parts In-Stock

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Ampacity Inc.

Singapore . 788 parts In-Stock

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AZTECH Wire

Italy . 889 parts In-Stock

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SupplyDigital Components

Austria . 7,962 parts In-Stock

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Microchip USA

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Kepictronics

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Perfect Parts

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Kulean Microsystems

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Corphita

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Problanco Electronics

Mexico . 930 parts In-Stock

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UHIMA Technologies

Türkiye . 561 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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TANS Electronics

Latvia . 234 parts In-Stock

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Corohmni

South Africa . 132 parts In-Stock

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Overview

Unlock a world of possibilities with the MC14011BFELG by Onsemi. As a leading manufacturer in logic gates, Onsemi guarantees top-notch quality and reliability. This versatile product offers 4 functions and 2 inputs, making it ideal for a wide range of applications. With a fast propagation delay of 250ns and a compact design, this logic gate is perfect for high-speed circuits where efficiency is key. Trust Onsemi to deliver unmatched value and performance with the MC14011BFELG. Experience the difference today!

Feature Benefit Bullets

Propagation Delay: 250 ns

This low propagation delay ensures quick processing of signals, making it ideal for applications requiring fast response times.

No. of Functions: 4

With four functions in one package, this product offers increased functionality and simplifies circuit design.

Nominal Supply Voltage: 5V

Operating at a common supply voltage of 5V, this logic gate is compatible with a wide range of systems and devices.

Load Capacitance: 50 pF

With a low load capacitance, this logic gate can easily drive external components without signal degradation.

Minimum Operating Temperature: -55 °C

Capable of operating in extreme cold temperatures, this product is suitable for harsh environments.

Maximum Operating Temperature: 125 °C

This high temperature range allows for reliable operation in a variety of conditions.

Technology: CMOS

Utilizing CMOS technology, this logic gate offers low power consumption and high noise immunity.

Terminal Form: GULL WING

The gull wing terminal form provides easy soldering and reliable connections, ensuring a secure installation.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this product can withstand moderate exposure to moisture during storage and handling.

Maximum Supply Voltage: 18V

This high supply voltage tolerance allows for flexibility in power supply options and compatibility with various systems.

Technical Specifications

Logic Gates MC14011BFELG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

250 ns

Propagation Delay (tpd):

250 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.05 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.275 mm

Trade Compliance

MC14011BFELG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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