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MC10H210MEL

Onsemi

MC10H210MEL by Onsemi

MC10H210MEL by Onsemi is a Logic Gates IC with 2 functions and 3 inputs. It has a fast propagation delay of 1.7 ns at -5.2V, suitable for high-speed applications. This ECL technology chip comes in a small outline package, ideal for surface mount designs in commercial extended temperature environments.

Median Price

$2.118

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

$2.000

1k+ parts

$1.790

10k+ parts

$1.680

4,000

-

$2.000

$1.790

$1.680

Verical

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.237

10k+ parts

-

4,000

-

-

$2.237

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,352 parts In-Stock

1+ parts

$2.109

100+ parts

-

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-

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2,352

$2.109

-

-

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Vyrian

USA . 2,737 parts In-Stock

1+ parts

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2,737

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Distributors (Availability)

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Corphita

USA . 1,442 parts In-Stock

1+ parts

$1.998

100+ parts

-

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1,442

$1.998

-

-

-

Corohmni

South Africa . 117 parts In-Stock

1+ parts

$2.220

100+ parts

-

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117

$2.220

-

-

-

Component Stockers USA

USA . 4,000 parts In-Stock

1+ parts

$2.260

100+ parts

$2.130

1k+ parts

$1.920

10k+ parts

-

4,000

$2.260

$2.130

$1.920

-

AZTECH Wire

Italy . 255 parts In-Stock

1+ parts

$22.080

100+ parts

-

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10k+ parts

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255

$22.080

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 19,082 parts In-Stock

1+ parts

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19,082

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Kepictronics

USA . 4,647 parts In-Stock

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4,647

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Continental Prestige Electronics

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$1.970

10k+ parts

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4,000

-

-

$1.970

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

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100+ parts

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4,000

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Microchip USA

USA . 3,953 parts In-Stock

1+ parts

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3,953

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TANS Electronics

Latvia . 3,796 parts In-Stock

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3,796

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SupplyDigital Components

Austria . 3,366 parts In-Stock

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3,366

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Problanco Electronics

Mexico . 2,633 parts In-Stock

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2,633

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Kulean Microsystems

USA . 1,642 parts In-Stock

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1,642

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Metaverse IC Inc.

Canada . 1,350 parts In-Stock

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1,350

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UHIMA Technologies

Türkiye . 866 parts In-Stock

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866

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Overview

Discover the power of the MC10H210MEL logic gates by Onsemi, designed to deliver superior performance and reliability in a compact package. With a fast propagation delay of 1.7ns and dual functions, this product is perfect for applications requiring quick response times and precise data processing. Trust in Onsemi's expertise and innovation to provide you with a high-quality solution that exceeds expectations. Upgrade your projects with the MC10H210MEL and experience unmatched efficiency and accuracy like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and helps protect the internal components of the logic gate, making it suitable for various environments.

Propagation Delay At Nominal Supply: 1.7 ns

Low propagation delay ensures fast operation and response times, making the logic gate efficient for time-sensitive applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and simplifying the manufacturing process.

No. of Functions: 2

Having multiple functions in a single component can help reduce the overall complexity of a circuit, leading to cost savings and improved reliability.

Nominal Supply Voltage / Vsup (V): -5.2

The specified supply voltage ensures compatibility with standard power sources, making it easy to integrate this logic gate into existing systems.

No. of Terminals: 16

Having a sufficient number of terminals allows for versatile connectivity options and facilitates the integration of the logic gate into different circuit configurations.

Technology: ECL

ECL technology offers high-speed performance and low power consumption, making this logic gate suitable for demanding applications that require fast operation.

Technical Specifications

Logic Gates MC10H210MEL attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

10H

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Inputs:

3

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Propagation Delay At Nominal Supply:

1.7 ns

Propagation Delay (tpd):

1.55 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.05 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

-5.46 V

Minimum Supply Voltage (Vsup):

-4.94 V

Nominal Supply Voltage / Vsup (V):

-5.2

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC10H210MEL Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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