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MC10H107FNR2G

Onsemi

MC10H107FNR2G by Onsemi

MC10H107FNR2G by Onsemi is a Logic Gate with 1.7ns Propagation Delay, -5.2V Nominal Voltage, and ECL Technology. It has 3 functions and 2 inputs in a square chip carrier package. Ideal for high-speed applications requiring fast signal processing within the temperature range of 0-75 °C.

Median Price

$2.320

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 8,273 parts In-Stock

1+ parts

-

100+ parts

$2.190

1k+ parts

$1.960

10k+ parts

$1.850

8,273

-

$2.190

$1.960

$1.850

Verical

USA . 2,875 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.450

10k+ parts

-

2,875

-

-

$2.450

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 110 parts In-Stock

1+ parts

$2.328

100+ parts

-

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-

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-

110

$2.328

-

-

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Vyrian

USA . 8,029 parts In-Stock

1+ parts

-

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-

1k+ parts

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10k+ parts

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8,029

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,565 parts In-Stock

1+ parts

$2.205

100+ parts

-

1k+ parts

-

10k+ parts

-

1,565

$2.205

-

-

-

Corohmni

South Africa . 336 parts In-Stock

1+ parts

$2.450

100+ parts

-

1k+ parts

-

10k+ parts

-

336

$2.450

-

-

-

Andel Nordic

Denmark . 5,270 parts In-Stock

1+ parts

$6.358

100+ parts

-

1k+ parts

$6.103

10k+ parts

$6.103

5,270

$6.358

-

$6.103

$6.103

AZTECH Wire

Italy . 1,189 parts In-Stock

1+ parts

$9.880

100+ parts

-

1k+ parts

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10k+ parts

-

1,189

$9.880

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 28,630 parts In-Stock

1+ parts

-

100+ parts

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28,630

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-

-

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Continental Prestige Electronics

USA . 8,273 parts In-Stock

1+ parts

-

100+ parts

$2.120

1k+ parts

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10k+ parts

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8,273

-

$2.120

-

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SupplyDigital Components

Austria . 6,568 parts In-Stock

1+ parts

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6,568

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Problanco Electronics

Mexico . 3,929 parts In-Stock

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3,929

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

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100+ parts

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3,500

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TANS Electronics

Latvia . 1,653 parts In-Stock

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1,653

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Kulean Microsystems

USA . 579 parts In-Stock

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579

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UHIMA Technologies

Türkiye . 126 parts In-Stock

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126

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Microchip USA

USA . 117 parts In-Stock

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117

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Overview

Discover the innovative MC10H107FNR2G by Onsemi, a high-quality logic gate that delivers reliable performance and precision. With a sleek chip carrier package design and advanced ECL technology, this product offers unparalleled speed with a propagation delay of just 1.7 ns. Perfect for a wide range of applications, from telecommunications to data processing, this logic gate provides customers with exceptional value and efficiency. Don't settle for anything less than the best – choose Onsemi for all your logic gate needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, ensuring the product will last longer and withstand various environmental conditions.

Propagation Delay At Nominal Supply: 1.7 ns

The low propagation delay ensures quick response times, making this logic gate suitable for high-speed applications where timing is critical.

Surface Mount: YES

Being surface mountable allows for easier and more efficient PCB assembly, saving time and effort during manufacturing.

No. of Functions: 3

Having multiple functions in one package reduces the need for additional components, saving space and simplifying circuit layout.

No. of Inputs: 2

With two inputs, this logic gate can perform basic logic operations efficiently, making it a versatile component for various digital circuits.

Nominal Supply Voltage / Vsup (V): -5.2

Operating within a specific voltage range ensures reliable performance and compatibility with other components in the system.

No. of Terminals: 20

Having a sufficient number of terminals allows for easy connections and integration into the circuit design.

Package Style (Meter): CHIP CARRIER

The chip carrier style provides a compact and efficient form factor, making it suitable for space-constrained applications.

Maximum Operating Temperature: 75 °C

The high maximum operating temperature ensures the logic gate can withstand elevated temperatures without degrading performance, increasing its reliability.

Minimum Operating Temperature: 0 °C

Operating at low temperatures makes this logic gate suitable for a wide range of environments, providing flexibility in use.

Technical Specifications

Logic Gates MC10H107FNR2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

10H

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.965 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

3

No. of Inputs:

2

No. of Terminals:

20

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TR

Peak Reflow Temperature (C):

260

Propagation Delay At Nominal Supply:

1.7 ns

Propagation Delay (tpd):

1.6 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

4.57 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

-5.46 V

Minimum Supply Voltage (Vsup):

-4.94 V

Nominal Supply Voltage / Vsup (V):

-5.2

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8.965 mm

Trade Compliance

MC10H107FNR2G Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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