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MC10H105MELG

Onsemi

MC10H105MELG by Onsemi

MC10H105MELG by Onsemi is a Logic Gate with 3 functions and inputs. It has a propagation delay of 1.2 ns at -5.2V, suitable for high-speed applications in commercial extended temperature range up to 75 °C. The small outline package with gull wing terminals makes it ideal for surface mount PCB designs.

Median Price

$2.320

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 51,601 parts In-Stock

1+ parts

-

100+ parts

$2.190

1k+ parts

$1.960

10k+ parts

$1.850

51,601

-

$2.190

$1.960

$1.850

Verical

USA . 4,644 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.450

10k+ parts

$2.313

4,644

-

-

$2.450

$2.313

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,050 parts In-Stock

1+ parts

$2.328

100+ parts

-

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-

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1,050

$2.328

-

-

-

DigiKey Marketplace

USA . 51,601 parts In-Stock

1+ parts

-

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51,601

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-

-

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Vyrian

USA . 8,304 parts In-Stock

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8,304

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 612 parts In-Stock

1+ parts

$2.205

100+ parts

-

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-

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-

612

$2.205

-

-

-

Corohmni

South Africa . 69 parts In-Stock

1+ parts

$2.450

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-

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69

$2.450

-

-

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AZTECH Wire

Italy . 656 parts In-Stock

1+ parts

$8.090

100+ parts

-

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656

$8.090

-

-

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Continental Prestige Electronics

USA . 51,601 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.120

10k+ parts

-

51,601

-

-

$2.120

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Problanco Electronics

Mexico . 8,101 parts In-Stock

1+ parts

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8,101

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TANS Electronics

Latvia . 6,866 parts In-Stock

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6,866

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Microchip USA

USA . 4,427 parts In-Stock

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4,427

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SupplyDigital Components

Austria . 3,498 parts In-Stock

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3,498

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Kepictronics

USA . 1,700 parts In-Stock

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1,700

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Kulean Microsystems

USA . 150 parts In-Stock

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150

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UHIMA Technologies

Türkiye . 69 parts In-Stock

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69

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Overview

Unlock the power of advanced logic gates with the MC10H105MELG by Onsemi. Designed with precision and expertise, this product offers unparalleled performance and reliability. Ideal for a wide range of applications, from telecommunications to industrial control systems, this logic gate is a game-changer in the world of electronic components. With fast propagation delay and low power consumption, customers can trust in the quality and efficiency of this product. Elevate your projects with the MC10H105MELG and experience the innovation and excellence that Onsemi brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and helps protect the internal components of the logic gates.

Propagation Delay At Nominal Supply: 1.3 ns

With a fast propagation delay of 1.3 ns, these logic gates are suitable for high-speed applications where quick processing is required.

Surface Mount: YES

Being surface mountable, these logic gates are easy to install and suitable for compact electronic circuits.

No. of Functions: 3

With three functions in one package, these logic gates offer versatility and efficiency in circuit design.

Nominal Supply Voltage: -5.2V

The -5.2V supply voltage ensures stable and reliable operation of the logic gates within the specified voltage range.

Maximum Operating Temperature: 75 °C

With a maximum operating temperature of 75 °C, these logic gates can withstand elevated temperatures in various environments.

Technical Specifications

Logic Gates MC10H105MELG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

10H

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Logic IC Type:

No. of Functions:

3

No. of Inputs:

3

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

23 mA

Propagation Delay At Nominal Supply:

1.3 ns

Propagation Delay (tpd):

1.2 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.05 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

-5.46 V

Minimum Supply Voltage (Vsup):

-4.94 V

Nominal Supply Voltage / Vsup (V):

-5.2

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC10H105MELG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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