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MC10H104PG

Onsemi

MC10H104PG by Onsemi

MC10H104PG by Onsemi is a 16-terminal ECL logic gate with 4 functions and 2 inputs. It offers a fast propagation delay of 1.75 ns at -5.2V, making it ideal for high-speed applications in commercial extended temperature environments. The package style is in-line with a rectangular shape, suitable for through-hole mounting on PCBs.

Median Price

$1.962

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 8,119 parts In-Stock

1+ parts

-

100+ parts

$1.850

1k+ parts

$1.660

10k+ parts

$1.560

8,119

-

$1.850

$1.660

$1.560

Verical

USA . 2,221 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.075

10k+ parts

-

2,221

-

-

$2.075

-

Distributors (In-Stock)

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Digiode

USA . 237 parts In-Stock

1+ parts

$1.966

100+ parts

-

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237

$1.966

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Vyrian

USA . 5,396 parts In-Stock

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5,396

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Distributors (Availability)

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Corphita

USA . 1,965 parts In-Stock

1+ parts

$1.863

100+ parts

-

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-

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1,965

$1.863

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-

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Corohmni

South Africa . 238 parts In-Stock

1+ parts

$2.070

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-

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238

$2.070

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AZTECH Wire

Italy . 1,185 parts In-Stock

1+ parts

$10.940

100+ parts

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1,185

$10.940

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Continental Prestige Electronics

USA . 9,244 parts In-Stock

1+ parts

-

100+ parts

$1.800

1k+ parts

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9,244

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$1.800

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SupplyDigital Components

Austria . 8,279 parts In-Stock

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8,279

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Kulean Microsystems

USA . 6,658 parts In-Stock

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6,658

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Problanco Electronics

Mexico . 1,826 parts In-Stock

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1,826

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TANS Electronics

Latvia . 1,456 parts In-Stock

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1,456

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Microchip USA

USA . 328 parts In-Stock

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328

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Perfect Parts

USA . 121 parts In-Stock

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121

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UHIMA Technologies

Türkiye . 94 parts In-Stock

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94

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Overview

Elevate your electronic designs with the MC10H104PG by Onsemi, a cutting-edge logic gate that delivers unparalleled performance and reliability. Crafted by the industry-leading manufacturer Onsemi, this product offers seamless integration, lightning-fast propagation delay, and versatile applications in various electronic systems. Whether you're designing high-speed communication networks or sophisticated computing systems, the MC10H104PG provides unmatched value, efficiency, and precision to meet all your design needs. Upgrade your projects today with this exceptional logic gate from Onsemi.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 1.9 ns

Low propagation delay ensures fast response times, making this product suitable for high-speed applications.

No. of Functions: 4

Provides versatility and flexibility in designing complex logic circuits.

Nominal Supply Voltage / Vsup (V): -5.2

Suitable operating voltage for reliable performance and compatibility with standard power supplies.

Maximum Operating Temperature: 75 °C

Ability to withstand high temperatures ensures reliability in various environmental conditions.

Technology: ECL

ECL technology offers high-speed operation and low power consumption, ideal for demanding applications.

Technical Specifications

Logic Gates MC10H104PG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

10H

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Length:

19.175 mm

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Propagation Delay At Nominal Supply:

1.9 ns

Propagation Delay (tpd):

1.75 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

4.44 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

-5.46 V

Minimum Supply Voltage (Vsup):

-4.94 V

Nominal Supply Voltage / Vsup (V):

-5.2

Surface Mount:

NO

Technology:

ECL

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MC10H104PG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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