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MC10H101M

Onsemi

MC10H101M by Onsemi

MC10H101M by Onsemi is a logic gate with 4 functions and 2 inputs. It has a propagation delay of 1.6 ns at -5.2V, suitable for high-speed applications in commercial electronics due to its ECL technology and small outline package style.

Median Price

$1.490

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 128 parts In-Stock

1+ parts

-

100+ parts

$1.490

1k+ parts

$1.240

10k+ parts

$1.100

128

-

$1.490

$1.240

$1.100

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 400 parts In-Stock

1+ parts

$1.159

100+ parts

-

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400

$1.159

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-

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Vyrian

USA . 3,628 parts In-Stock

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3,628

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Distributors (Availability)

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Corphita

USA . 2,234 parts In-Stock

1+ parts

$1.098

100+ parts

-

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-

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2,234

$1.098

-

-

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Corohmni

South Africa . 224 parts In-Stock

1+ parts

$1.220

100+ parts

-

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224

$1.220

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AZTECH Wire

Italy . 227 parts In-Stock

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$8.420

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227

$8.420

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$25.335

100+ parts

$23.055

1k+ parts

$20.775

10k+ parts

-

2,000

$25.335

$23.055

$20.775

-

SupplyDigital Components

Austria . 7,337 parts In-Stock

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7,337

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Kulean Microsystems

USA . 6,064 parts In-Stock

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6,064

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

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4,000

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Problanco Electronics

Mexico . 3,576 parts In-Stock

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3,576

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TANS Electronics

Latvia . 1,993 parts In-Stock

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1,993

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UHIMA Technologies

Türkiye . 531 parts In-Stock

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531

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Microchip USA

USA . 437 parts In-Stock

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437

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Kepictronics

USA . 294 parts In-Stock

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294

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Overview

Enhance your electronic designs with the MC10H101M by Onsemi, a top-quality logic gate that offers unparalleled performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this product guarantees superior functionality and durability. Ideal for a wide range of applications, this logic gate provides fast propagation delay and high speed operation, making it perfect for demanding projects. Experience the value and benefits of the MC10H101M, with its advanced technology and innovative design, delivering exceptional results for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the logic gate.

Propagation Delay At Nominal Supply: 1.7 ns

Fast propagation delay ensures efficient operation and quick response time of the logic gate.

Surface Mount: YES

Surface mount capability makes it easy to integrate the logic gate onto a circuit board, saving space and improving overall design.

No. of Functions: 4

Having 4 functions in one component reduces the need for multiple components, simplifying circuit design and reducing cost.

No. of Inputs: 2

Having 2 inputs allows for simple logic operations to be performed with this gate, making it versatile for a variety of applications.

Nominal Supply Voltage / Vsup (V): -5.2

Nominal supply voltage of -5.2V ensures compatibility with standard power supplies in many electronic systems.

Maximum Operating Temperature: 75 °C

High maximum operating temperature of 75 °C allows for reliable performance in a range of environments and applications.

Technology: ECL

Emitter-Coupled Logic (ECL) technology offers high-speed operation and low noise, making this logic gate suitable for high-performance systems.

Technical Specifications

Logic Gates MC10H101M attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

10H

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

29 mA

Propagation Delay At Nominal Supply:

1.7 ns

Propagation Delay (tpd):

1.6 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.05 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

-5.46 V

Minimum Supply Voltage (Vsup):

-4.94 V

Nominal Supply Voltage / Vsup (V):

-5.2

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC10H101M Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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