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MC10EL35DTG

Onsemi

MC10EL35DTG by Onsemi

MC10EL35DTG by Onsemi is a 2-bit ECL flip-flop with 0.7 ns propagation delay, suitable for industrial applications. Operating at -40 to 85 °C, it has a max frequency of 1.4 GHz and requires Vsup b/w 4.2-5.7V. With GULL WING terminals and MSL level 3, it's ideal for high-speed digital circuits in compact layouts.

Median Price

$10.236

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 400 parts In-Stock

1+ parts

$17.673

100+ parts

$16.082

1k+ parts

$14.492

10k+ parts

-

400

$17.673

$16.082

$14.492

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Rochester

USA . 8,752 parts In-Stock

1+ parts

-

100+ parts

$2.800

1k+ parts

$2.510

10k+ parts

$2.360

8,752

-

$2.800

$2.510

$2.360

Distributors (In-Stock)

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Digiode

USA . 1,437 parts In-Stock

1+ parts

$2.964

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1,437

$2.964

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Vyrian

USA . 3,062 parts In-Stock

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3,062

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ACDS - Activité Composants Distribution Service

France . 97 parts In-Stock

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Bristol Electronics

USA . 97 parts In-Stock

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Dan-Mar Components

USA . 97 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,164 parts In-Stock

1+ parts

$2.808

100+ parts

-

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1,164

$2.808

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Corohmni

South Africa . 152 parts In-Stock

1+ parts

$2.980

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152

$2.980

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AZTECH Wire

Italy . 128 parts In-Stock

1+ parts

$12.160

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128

$12.160

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Advanced Electronics

New Zealand . 400 parts In-Stock

1+ parts

$17.673

100+ parts

$16.082

1k+ parts

$14.492

10k+ parts

-

400

$17.673

$16.082

$14.492

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QUARKTWIN TECHNOLOGY LTD

USA . 10,961 parts In-Stock

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Continental Prestige Electronics

USA . 8,818 parts In-Stock

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$2.650

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$2.650

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Microchip USA

USA . 5,048 parts In-Stock

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Problanco Electronics

Mexico . 4,024 parts In-Stock

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Kulean Microsystems

USA . 2,641 parts In-Stock

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TANS Electronics

Latvia . 2,178 parts In-Stock

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UHIMA Technologies

Türkiye . 871 parts In-Stock

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871

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SupplyDigital Components

Austria . 231 parts In-Stock

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Overview

Experience the cutting-edge technology of the MC10EL35DTG by Onsemi, a top-of-the-line Latches & Flip-Flops device designed to exceed your expectations. With a focus on quality and innovation, Onsemi offers products that deliver superior performance and reliability. Ideal for a wide range of applications, this product provides fast propagation delay, complementary output polarity, and high operating frequency, making it a valuable asset for any project. Trust Onsemi for superior components that elevate your work to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring long-lasting performance.

Propagation Delay At Nominal Supply: 0.745 ns

Fast propagation delay allows for quick response times and efficient operation.

Surface Mount: YES

Easily mountable on circuit boards, simplifying the installation process.

Nominal Supply Voltage / Vsup (V): 5

Compatible with common supply voltages, making it versatile for various applications.

Trigger Type: POSITIVE EDGE

Provides precise triggering for accurate data capture and processing.

Technical Specifications

Latches & Flip-Flops MC10EL35DTG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Family:

10EL

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

1400000000 Hz

Moisture Sensitivity Level (MSL):

3

No. of Bits:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

32 mA

Propagation Delay At Nominal Supply:

.745 ns

Propagation Delay (tpd):

.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3 mm

Minimum fmax:

1800 MHz

Trade Compliance

MC10EL35DTG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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