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SN74LVC2G74YZPR

Texas Instruments

SN74LVC2G74YZPR by Texas Instruments

SN74LVC2G74YZPR by Texas Instruments is a latches & flip-flops IC with 5.9ns propagation delay, 1.8V nominal voltage, and 32A max I (ol). It is ideal for applications requiring positive edge triggering, such as industrial-grade systems operating b/w -40°C to 85°C with a max frequency of 175MHz.

Median Price

$0.540

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 7 parts In-Stock

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$0.367

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Arrow

USA . 19 parts In-Stock

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$0.540

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Texas Instruments

USA . 353,082 parts In-Stock

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$0.683

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$0.464

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$0.238

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$0.683

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$0.238

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Mouser Electronics

USA . 1,973 parts In-Stock

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$0.740

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$0.430

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$0.396

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$0.366

1,973

$0.740

$0.430

$0.396

$0.366

DigiKey

USA . 4,067 parts In-Stock

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$0.840

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$0.474

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$0.421

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$0.375

4,067

$0.840

$0.474

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$0.375

Verical

USA . 19 parts In-Stock

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$0.350

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Rochester

USA . 6 parts In-Stock

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$0.467

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$0.388

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$0.345

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$0.467

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$0.345

Distributors (In-Stock)

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Digiode

USA . 2,370 parts In-Stock

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$0.276

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$0.276

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Nova Conductors

Japan . 98 parts In-Stock

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$0.386

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Vyrian

USA . 51,599 parts In-Stock

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Cyclops Electronics Ltd

UK . 6,000 parts In-Stock

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Chip Stock

USA . 4,350 parts In-Stock

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Bristol Electronics

USA . 2,720 parts In-Stock

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$0.487

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$0.210

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$0.195

2,720

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$0.487

$0.210

$0.195

Microfarads

USA . 2,625 parts In-Stock

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Dan-Mar Components

USA . 2,339 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,223 parts In-Stock

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Sea View Technologies

USA . 2,125 parts In-Stock

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Netsource Technology, Inc.

USA . 443 parts In-Stock

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Prism Electronics

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Distributors (Availability)

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Ampacity Inc.

Singapore . 51,583 parts In-Stock

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$0.259

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Semicontronic

India . 51,458 parts In-Stock

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$0.259

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$0.253

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$0.251

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$0.259

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Corphita

USA . 1,350 parts In-Stock

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$0.262

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$0.262

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Aranea Global

USA . 500 parts In-Stock

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$0.378

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$0.363

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$0.378

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Corohmni

South Africa . 394 parts In-Stock

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$0.379

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Argo Parts USA

USA . 4,221 parts In-Stock

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$0.386

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$0.374

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Continental Prestige Electronics

USA . 2,904 parts In-Stock

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$0.386

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$0.378

2,904

$0.386

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Microchip USA

USA . 2,754 parts In-Stock

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$2.310

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Parana Technologies

USA . 1,813 parts In-Stock

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$27.449

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$35.989

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DigiPath Technology Company

USA . 1,251 parts In-Stock

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$30.225

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ChromeModa Solutions

Germany . 2,872 parts In-Stock

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$30.842

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$25.290

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IDEA Electronic Components Group

UK . 1,554 parts In-Stock

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$30.842

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$29.300

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$27.758

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Perfect Parts

USA . 37,528 parts In-Stock

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Kepictronics

USA . 3,000 parts In-Stock

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Overview

Upgrade your electronics with the SN74LVC2G74YZPR from Texas Instruments, a leading manufacturer known for quality and reliability. This latch & flip-flop device offers fast propagation delay, low power consumption, and a wide operating temperature range, making it ideal for industrial applications. With a compact size and surface mount design, this product is easy to integrate into your projects. Trust Texas Instruments to deliver top-notch performance and efficiency in every component. Step up your game with the SN74LVC2G74YZPR today!

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 5.9 ns

Low propagation delay ensures fast response time for the latch or flip-flop, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount technology offers space-saving and efficient assembly onto PCBs, making it convenient for compact electronic designs.

Nominal Supply Voltage / Vsup (V): 1.8

Low nominal supply voltage helps in reducing power consumption and extending battery life in portable devices.

Maximum I (ol): 32 Amp

High output current capability allows for driving external loads without the need for additional amplification circuitry.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures reliability and stability in harsh environmental conditions.

Trigger Type: POSITIVE EDGE

Positive edge trigger simplifies timing control and synchronization in sequential logic circuits.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Technical Specifications

Latches & Flip-Flops SN74LVC2G74YZPR attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-XBGA-B8

JESD-609 Code:

e1

Length:

1.9 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

175000000 Hz

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA8,2X4,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

5.9 ns

Propagation Delay (tpd):

14.4 ns

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

.9 mm

Minimum fmax:

200 MHz

Trade Compliance

SN74LVC2G74YZPR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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