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MC10E1652FNG

Onsemi

MC10E1652FNG by Onsemi

MC10E1652FNG by Onsemi is a digital arithmetic circuit with 2 functions, operating at 5V. It has a propagation delay of 1.075ns and operates b/w 0-85 °C. Ideal for high-speed applications requiring complementary outputs in a compact chip carrier package.

Median Price

$31.635

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 23,922 parts In-Stock

1+ parts

-

100+ parts

$28.120

1k+ parts

$25.160

10k+ parts

$23.680

23,922

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$28.120

$25.160

$23.680

DigiKey

USA . 23,922 parts In-Stock

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23,922

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Verical

USA . 7,064 parts In-Stock

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100+ parts

$35.150

1k+ parts

$31.450

10k+ parts

$29.600

7,064

-

$35.150

$31.450

$29.600

Distributors (In-Stock)

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Digiode

USA . 673 parts In-Stock

1+ parts

$29.697

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673

$29.697

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Vyrian

USA . 7,099 parts In-Stock

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7,099

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Semtec, LLC

USA . 15 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 5 parts In-Stock

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5

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Distributors (Availability)

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Benley Electronics

USA . 53 parts In-Stock

1+ parts

$0.450

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53

$0.450

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AZTECH Wire

Italy . 94 parts In-Stock

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$8.340

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$8.340

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Corphita

USA . 1,103 parts In-Stock

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$28.134

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$28.134

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Corohmni

South Africa . 475 parts In-Stock

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$31.260

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475

$31.260

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Continental Prestige Electronics

USA . 24,099 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 14,536 parts In-Stock

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14,536

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Microchip USA

USA . 3,609 parts In-Stock

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SupplyDigital Components

Austria . 2,060 parts In-Stock

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Kulean Microsystems

USA . 681 parts In-Stock

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TANS Electronics

Latvia . 543 parts In-Stock

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Problanco Electronics

Mexico . 460 parts In-Stock

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UHIMA Technologies

Türkiye . 76 parts In-Stock

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Authorized Procurement Solutions

USA . 10 parts In-Stock

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10

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Overview

Experience the cutting-edge technology of Onsemi with the MC10E1652FNG, a high-quality digital arithmetic circuit designed to meet your electronic needs. With a focus on innovation and reliability, Onsemi delivers products that exceed industry standards, providing customers with unmatched performance and durability. Ideal for a variety of applications, this product offers unparalleled value and benefits, making it the perfect choice for your next project. Trust Onsemi to deliver excellence in every component, bringing your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and reliability for long-lasting performance.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation onto circuit boards.

No. of Functions: 2

Having multiple functions in one component saves space and simplifies circuit design.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level for compatibility with various systems.

Propagation Delay (tpd): 1.075 ns

Fast propagation delay ensures quick data processing and high-speed operation.

Maximum Operating Temperature: 85 °C

Can operate efficiently at high temperatures without risking performance issues.

Technology: ECL

Utilizing Emitter-Coupled Logic technology ensures high-speed and low-power consumption.

Minimum Supply Voltage (Vsup): 4.75 V

Allows for operation at a lower voltage for energy efficiency and flexibility in power sources.

Technical Specifications

Digital Arithmetic Circuits MC10E1652FNG attributes and parameters. Explore more Digital Arithmetic Circuits devices from Onsemi

Specs

Family:

10E

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.965 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

1.075 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8.965 mm

Trade Compliance

MC10E1652FNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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