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MC10123L

Onsemi

MC10123L by Onsemi

MC10123L by Onsemi is a bus driver & transceiver with 3 functions, -5.2V power supply, and 4.4ns propagation delay. Ideal for ECL technology applications requiring open-emitter output characteristics in a ceramic package with 16 terminals.

Median Price

$1.738

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 3,175 parts In-Stock

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-

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$1.560

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$1.390

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$1.310

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$1.560

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$1.310

DigiKey

USA . 3,175 parts In-Stock

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$2.050

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Verical

USA . 3,175 parts In-Stock

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$1.738

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$1.637

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$1.637

Distributors (In-Stock)

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Digiode

USA . 1,920 parts In-Stock

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$1.644

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Vyrian

USA . 390 parts In-Stock

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$1.730

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$1.730

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Voyager Components

USA . 269 parts In-Stock

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$2.141

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$2.141

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$2.141

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$2.141

DigiKey Marketplace

USA . 3,175 parts In-Stock

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Electronic Expediters

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EMSNET

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R&J Components

USA . 116 parts In-Stock

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LWI Electronics Inc

India . 47 parts In-Stock

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ABC Electronics Ltd.

UK . 28 parts In-Stock

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ICP Electronique

France . 23 parts In-Stock

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Mil-Aero Solutions, Inc.

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Prism Electronics

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Resion

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Electronics Depot

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ECAB

Sweden . 5 parts In-Stock

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M&R Communications

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Distributors (Availability)

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Corphita

USA . 264 parts In-Stock

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$1.557

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264

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Corohmni

South Africa . 244 parts In-Stock

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$1.730

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Component Stockers USA

USA . 3,348 parts In-Stock

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$1.750

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$1.640

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$1.490

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QUARKTWIN TECHNOLOGY LTD

USA . 15,836 parts In-Stock

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SupplyDigital Components

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Kulean Microsystems

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Problanco Electronics

Mexico . 6,157 parts In-Stock

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TANS Electronics

Latvia . 3,386 parts In-Stock

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Continental Prestige Electronics

USA . 3,175 parts In-Stock

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$1.510

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UHIMA Technologies

Türkiye . 697 parts In-Stock

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Metaverse IC Inc.

Canada . 300 parts In-Stock

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Kepictronics

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Perfect Parts

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A-Plus Industry Inc.

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Overview

Enhance your electronic designs with the MC10123L bus driver & transceiver by Onsemi. Known for their high-quality components, Onsemi delivers reliability and innovation in every product. The MC10123L offers 3 functions in a compact rectangular package, making it ideal for a wide range of applications. With a fast propagation delay of 4.4 ns and open-emitter output characteristics, this component ensures optimal performance. Trust Onsemi to provide cutting-edge technology that meets your design needs efficiently and effectively. Elevate your projects with the MC10123L today!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed body material provides durability and protection for the internal components, ensuring reliability in various operating conditions.

No. of Functions: 3

Having multiple functions in one device allows for efficient communication and control within the bus driver and transceiver system.

Power Supplies (V): -5.2

The power supply voltage of -5.2V is suitable for driving bus lines and transmitting signals in a low-power consumption manner.

Propagation Delay (tpd): 4.4 ns

The low propagation delay of 4.4 ns ensures fast and efficient data transmission, making this product ideal for high-speed communication applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can withstand high temperatures, making it suitable for use in extreme environmental conditions.

Output Characteristics: OPEN-EMITTER WITH CUT-OFF

The open-emitter with cut-off output characteristics allow for precise control and modulation of signals, ensuring accurate communication between devices.

Technology: ECL

The ECL (Emitter-Coupled Logic) technology offers high-speed performance and low power consumption, making this product efficient and reliable for bus driver and transceiver applications.

Technical Specifications

Bus Driver & Transceivers MC10123L attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Additional Features:

WITH 4-3-3 INPUT NOR FUNCTIONS

Family:

10K

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.495 mm

Logic IC Type:

No. of Bits:

1

No. of Functions:

3

No. of Ports:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Output Characteristics:

OPEN-EMITTER WITH CUT-OFF

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

-5.2

Propagation Delay (tpd):

4.4 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Bus Driver/Transceivers

Surface Mount:

NO

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MC10123L Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-269-2205, 5962012692205

NIIN

012692205

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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