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MC100E336FN

Onsemi

MC100E336FN by Onsemi

MC100E336FN by Onsemi is a 3-bit bus driver with 1ns propagation delay at 5V. It features ECL technology, operates b/w 0-85 °C, and has independent control for applications requiring fast signal transmission in electronic systems.

Median Price

$4.421

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 518 parts In-Stock

1+ parts

-

100+ parts

$3.930

1k+ parts

$3.520

10k+ parts

$3.310

518

-

$3.930

$3.520

$3.310

Verical

USA . 518 parts In-Stock

1+ parts

-

100+ parts

$4.912

1k+ parts

$4.662

10k+ parts

-

518

-

$4.912

$4.662

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,322 parts In-Stock

1+ parts

$3.610

100+ parts

-

1k+ parts

-

10k+ parts

-

2,322

$3.610

-

-

-

Digiode

USA . 310 parts In-Stock

1+ parts

$4.161

100+ parts

-

1k+ parts

-

10k+ parts

-

310

$4.161

-

-

-

DigiKey Marketplace

USA . 518 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

518

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 288 parts In-Stock

1+ parts

$3.610

100+ parts

-

1k+ parts

-

10k+ parts

-

288

$3.610

-

-

-

Corphita

USA . 2,269 parts In-Stock

1+ parts

$3.942

100+ parts

-

1k+ parts

-

10k+ parts

-

2,269

$3.942

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 16,802 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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16,802

-

-

-

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SupplyDigital Components

Austria . 7,461 parts In-Stock

1+ parts

-

100+ parts

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7,461

-

-

-

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TANS Electronics

Latvia . 1,899 parts In-Stock

1+ parts

-

100+ parts

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1,899

-

-

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Kulean Microsystems

USA . 1,452 parts In-Stock

1+ parts

-

100+ parts

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1,452

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Problanco Electronics

Mexico . 593 parts In-Stock

1+ parts

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593

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Continental Prestige Electronics

USA . 518 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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518

-

-

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UHIMA Technologies

Türkiye . 16 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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16

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Overview

Experience seamless data transmission with the MC100E336FN by Onsemi, a high-quality bus driver & transceiver designed to meet your connectivity needs. Manufactured with precision and reliability in mind, this product offers fast propagation delay, surface-mount capability, and independent control for optimal performance. Ideal for a wide range of applications, this chip carrier is perfect for applications where speed and accuracy are crucial. Trust Onsemi to deliver cutting-edge technology that exceeds expectations. Elevate your projects with the MC100E336FN and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring long-lasting performance.

Propagation Delay At Nominal Supply: 1 ns

The low propagation delay ensures quick and efficient signal transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on PCBs, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 5

With a nominal supply voltage of 5V, this product can be easily integrated into standard electronic systems.

No. of Terminals: 28

The high number of terminals provide flexibility in connecting the device to other components, allowing for versatile usage.

Output Characteristics: OPEN-EMITTER WITH CUT-OFF

The open-emitter with cut-off output characteristics offer a clear signal output, enhancing the reliability and accuracy of data transmission.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures precise timing control, enabling synchronous operation in communication systems.

Technology: ECL

The ECL technology offers high-speed operation and low power consumption, making this product ideal for demanding applications.

Technical Specifications

Bus Driver & Transceivers MC100E336FN attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Control Type:

INDEPENDENT CONTROL

Count Direction:

UNIDIRECTIONAL

Family:

100E

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.505 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

3

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER WITH CUT-OFF

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

173 mA

Propagation Delay At Nominal Supply:

1 ns

Propagation Delay (tpd):

1 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn80Pb20)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

11.505 mm

Trade Compliance

MC100E336FN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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