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MC10E336FN

Onsemi

MC10E336FN by Onsemi

MC10E336FN by Onsemi is a 3-bit bus driver with 1ns propagation delay at 5V. It features ECL technology, operates b/w 0-85 °C, and has independent control. Ideal for applications requiring fast signal transmission in electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,480 parts In-Stock

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1,480

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Digiode

USA . 1,089 parts In-Stock

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1,089

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Distributors (Availability)

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TANS Electronics

Latvia . 6,344 parts In-Stock

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6,344

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Kulean Microsystems

USA . 4,255 parts In-Stock

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4,255

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SupplyDigital Components

Austria . 968 parts In-Stock

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968

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Problanco Electronics

Mexico . 428 parts In-Stock

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428

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Corphita

USA . 367 parts In-Stock

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367

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Corohmni

South Africa . 318 parts In-Stock

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318

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UHIMA Technologies

Türkiye . 141 parts In-Stock

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Overview

Enhance your electronic designs with the MC10E336FN from Onsemi, a leading manufacturer known for top-quality products. This bus driver and transceiver offers lightning-fast propagation delay of just 1 ns, making it ideal for high-speed applications. With its advanced technology and reliable performance, this chip carrier ensures seamless data transmission and efficient signal processing. Upgrade your systems with the MC10E336FN and experience the benefits of superior quality and precision engineering.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the product, ensuring a longer lifespan and reliability.

Propagation Delay At Nominal Supply: 1 ns

Low propagation delay ensures fast and efficient data transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying installation.

Nominal Supply Voltage / Vsup (V): 5

Operates on a standard 5V supply, making it compatible with a wide range of systems and power sources.

No. of Terminals: 28

Ample number of terminals allow for versatile connectivity options and compatibility with various systems.

Technology: ECL

ECL technology offers high-speed performance and low power consumption, making this product ideal for demanding applications.

Technical Specifications

Bus Driver & Transceivers MC10E336FN attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Additional Features:

NECL MODE: 0V VCC WITH VEE = -4.2V TO -5.7V

Control Type:

INDEPENDENT CONTROL

Count Direction:

UNIDIRECTIONAL

Family:

10E

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.5062 mm

No. of Bits:

3

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER WITH CUT-OFF

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

150 mA

Propagation Delay At Nominal Supply:

1 ns

Propagation Delay (tpd):

1 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

11.5062 mm

Trade Compliance

MC10E336FN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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