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MC10192P

Onsemi

MC10192P by Onsemi

MC10192P by Onsemi is a 16-terminal bus driver with 4 functions. It features a propagation delay of 4.5 ns and operates b/w -30 to 85 °C. Ideal for applications requiring open-collector output characteristics in ECL technology circuits.

Median Price

$4.330

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

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Freelance Electronics

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Bristol Electronics

USA . 15 parts In-Stock

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Vyrian

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Prism Electronics

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Inland Empire Components Inc.

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LWI Electronics Inc

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PAR Electronics

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Zilex Electronics Inc.

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Resion

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Sogenti Electronics

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EMSNET

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Corohmni

South Africa . 144 parts In-Stock

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Perfect Parts

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GreenTree Electronics

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Kulean Microsystems

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Problanco Electronics

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Corphita

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UHIMA Technologies

Türkiye . 710 parts In-Stock

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Infinite Electronics LLP (Excess)

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TANS Electronics

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Cyclops Electronics Ltd (Excess)

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Overview

Enhance your electronic designs with the MC10192P from Onsemi, a leading manufacturer in the industry. This bus driver and transceiver offers unparalleled quality and reliability, making it an essential component for a wide range of applications. With its advanced features and high performance, this product delivers exceptional value to customers by providing fast propagation delay, open-collector output characteristics, and a wide operating temperature range. Trust Onsemi's expertise and innovation to take your projects to the next level with the MC10192P.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy body material provides durability and protection, making the product resistant to damage and wear over time.

No. of Functions: 4

Having 4 functions in one device offers versatility and efficiency, allowing for multiple tasks to be performed effectively.

Package Shape: RECTANGULAR

Rectangular package shape provides easy integration and compact design, making it suitable for space-saving applications.

No. of Bits: 2

2 bits ensure effective data processing and communication, making the product suitable for handling binary information.

No. of Terminals: 16

With 16 terminals, the product enables seamless connectivity and integration with external components, enhancing its functionality.

Package Style (Meter): IN-LINE

In-line package style facilitates easy installation and maintenance, making it convenient for users to work with the product.

Propagation Delay (tpd): 4.5 ns

Low propagation delay of 4.5 ns ensures fast operation and responsiveness, making the product ideal for high-speed applications.

Maximum Operating Temperature: 85 °C

Maximum operating temperature of 85 °C provides reliability and performance in varying environmental conditions.

Output Characteristics: OPEN-COLLECTOR

Open-collector output characteristics offer flexibility and compatibility with different systems, enhancing the product's versatility.

Minimum Operating Temperature: -30 °C

Minimum operating temperature of -30 °C ensures reliable performance even in cold environments, making the product suitable for a wide range of applications.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides strong solder connections and resistance to corrosion, enhancing the product's durability and reliability.

Terminal Position: DUAL

Dual terminal position allows for convenient installation and connectivity, ensuring ease of use and compatibility with different systems.

No. of Ports: 2

Having 2 ports enables simultaneous communication and data transfer, making the product efficient and suitable for multitasking applications.

Maximum Seated Height: 4.44 mm

Maximum seated height of 4.44 mm offers compactness and space-saving design, making the product suitable for constrained environments.

Width: 7.62 mm

Width of 7.62 mm provides a slim profile and easy integration, making the product suitable for applications with limited space.

Output Polarity: COMPLEMENTARY

Complementary output polarity ensures consistent and accurate signal processing, enhancing the product's performance and reliability.

Maximum Time At Peak Reflow Temperature (s): 30

Maximum time at peak reflow temperature of 30 seconds ensures proper soldering and reliability during the manufacturing process.

Peak Reflow Temperature °C: 235

Peak reflow temperature of 235 °C ensures stable and secure soldering connections, enhancing the product's durability and performance.

Length: 19.175 mm

Length of 19.175 mm provides a compact form factor and easy integration, making the product suitable for space-constrained applications.

Technology: ECL

ECL technology offers high-speed performance and energy efficiency, making the product suitable for demanding applications that require fast data processing.

Terminal Form: THROUGH-HOLE

Through-hole terminal form ensures secure and reliable connections, making the product durable and resistant to mechanical stress.

Terminal Pitch: 2.54 mm

Terminal pitch of 2.54 mm provides compatibility and ease of installation, making the product suitable for various electronic systems and applications.

Technical Specifications

Bus Driver & Transceivers MC10192P attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

10K

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

Length:

19.175 mm

Logic IC Type:

No. of Bits:

2

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

235

Propagation Delay (tpd):

4.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Surface Mount:

NO

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.62 mm

Trade Compliance

MC10192P Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-249-6237, 5962012496237

NIIN

012496237

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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