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MC10123FN

Onsemi

MC10123FN by Onsemi

MC10123FN by Onsemi is a 3-function bus driver & transceiver in a square chip carrier package. It operates at -30 to 85 °C with a propagation delay of 4.4 ns, suitable for ECL technology applications requiring open-emitter output characteristics.

Median Price

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Lifecycle Status

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Digiode

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J & M Industries LLC

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Semi Source

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Resion

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Problanco Electronics

Mexico . 7,226 parts In-Stock

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Kepictronics

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Kulean Microsystems

USA . 4,927 parts In-Stock

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TANS Electronics

Latvia . 3,405 parts In-Stock

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SupplyDigital Components

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Corphita

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Overview

Enhance your electronic designs with the MC10123FN by Onsemi, a top-quality bus driver and transceiver that offers unmatched reliability and performance. Manufactured by industry leader Onsemi, this chip carrier package boasts three functions in a compact square shape, making it ideal for a wide range of applications. With a low propagation delay of 4.4 ns and open-emitter output characteristics, this product ensures efficient signal transmission. Upgrade your projects with the MC10123FN and experience the value and benefits that Onsemi brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, ideal for use in portable devices or rugged environments.

Surface Mount: YES

Surface mountability ensures easy and efficient installation on circuit boards, saving space and reducing assembly time.

No. of Functions: 3

Having multiple functions in one component reduces the need for additional components, saving cost and board space.

Power Supplies (V): -5.2

Stable power supply at -5.2V ensures reliable and precise operation of the bus driver and transceiver.

Package Shape: SQUARE

Square package shape facilitates easy placement and alignment on circuit boards, making it convenient for assembly.

No. of Terminals: 20

Having 20 terminals allows for connectivity to multiple other components or circuits, enhancing versatility and functionality.

Propagation Delay (tpd): 4.4 ns

Low propagation delay of 4.4 ns ensures fast signal transmission, making this product suitable for high-speed data transfer applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85 °C ensures reliability and performance in various environmental conditions.

Output Characteristics: OPEN-EMITTER WITH CUT-OFF

Open-emitter with cut-off output characteristics allow for precise control and efficient signal transmission in the circuit.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature of -30 °C enables the product to function in cold environments without any performance issues.

Terminal Finish: Tin/Lead (Sn80Pb20)

Tin/Lead terminal finish ensures good solderability and electrical connectivity, enhancing the reliability and longevity of the product.

No. of Ports: 2

Having 2 ports allows for connection to multiple external devices or systems, increasing the versatility and applicability of the product.

Width: 8.965 mm

Compact width of 8.965 mm saves space on the circuit board, making it suitable for applications with limited board real estate.

Output Polarity: TRUE

True output polarity ensures accurate signal representation, preventing errors or misinterpretations in the data transmission process.

Technology: ECL

ECL (Emitter-Coupled Logic) technology offers high-speed performance and low power consumption, making this product efficient for signal processing tasks.

Terminal Pitch: 1.27 mm

Having a terminal pitch of 1.27 mm allows for easy and precise connection on the circuit board, ensuring proper signal flow and connectivity.

Technical Specifications

Bus Driver & Transceivers MC10123FN attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Additional Features:

WITH 4-3-3 INPUT NOR FUNCTIONS

Family:

10K

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e0

Length:

8.965 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

3

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Output Characteristics:

OPEN-EMITTER WITH CUT-OFF

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

-5.2

Propagation Delay (tpd):

4.4 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Bus Driver/Transceivers

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn80Pb20)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.965 mm

Trade Compliance

MC10123FN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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