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MC10192FNR2

Onsemi

MC10192FNR2 by Onsemi

MC10192FNR2 by Onsemi is a 20-terminal chip carrier with 4 functions and 2 bits. It features a propagation delay of 4.5 ns, operating temperature range of -30 to 85 °C, and ECL technology. Ideal for bus driver applications due to its open-collector output characteristics and complementary polarity.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,509 parts In-Stock

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Digiode

USA . 1,374 parts In-Stock

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R&J Components

USA . 290 parts In-Stock

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ECAB

Sweden . 52 parts In-Stock

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TANS Electronics

Latvia . 8,152 parts In-Stock

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Problanco Electronics

Mexico . 7,364 parts In-Stock

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Corphita

USA . 1,652 parts In-Stock

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SupplyDigital Components

Austria . 1,554 parts In-Stock

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Kulean Microsystems

USA . 1,226 parts In-Stock

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UHIMA Technologies

Türkiye . 513 parts In-Stock

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Corohmni

South Africa . 282 parts In-Stock

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Perfect Parts

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Overview

Experience seamless communication with the MC10192FNR2 bus driver & transceiver from Onsemi. Trusted for its unmatched quality and reliability, this versatile chip carrier offers 4 functions in a compact square package. Perfect for a wide range of applications, this open-collector output device ensures fast data transmission with a propagation delay of just 4.5 ns. With a temperature range of -30 °C to 85°C, customers can trust that their data will be securely transmitted at all times. Upgrade your communication systems today with the MC10192FNR2 for unparalleled performance and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it easy to handle and long-lasting.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and providing a sleek appearance.

No. of Functions: 4

Having 4 functions in one component reduces the need for multiple components, simplifies circuit design, and increases overall efficiency.

Package Shape: SQUARE

The square shape of the package provides stability and ease of positioning on a circuit board, ensuring a secure fit.

No. of Bits: 2

With 2 bits, the product is able to handle binary data effectively, making it suitable for various digital signal processing applications.

No. of Terminals: 20

Having 20 terminals allows for multiple connection options and flexibility in circuit design, accommodating various input and output requirements.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers high density packaging, reducing the overall footprint of the component and enhancing thermal performance.

Propagation Delay (tpd): 4.5 ns

The low propagation delay of 4.5 ns ensures fast response times and efficient signal transmission, crucial for high-speed data processing applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the product can withstand high temperatures, making it suitable for industrial and automotive applications.

Output Characteristics: OPEN-COLLECTOR

The open-collector output characteristics allow for easy interfacing with various logic circuits, providing versatility and compatibility in different systems.

Minimum Operating Temperature: -30 °C

The product's minimum operating temperature of -30 °C ensures reliable performance even in harsh environmental conditions, making it suitable for outdoor applications.

Terminal Finish: TIN LEAD

The tin lead terminal finish offers good solderability and conductivity, ensuring secure connections and reliable electrical performance.

Terminal Position: QUAD

The quad terminal position provides stability and ease of installation on a circuit board, improving overall reliability and durability of the product.

No. of Ports: 2

Having 2 ports allows for versatile interfacing and connectivity options, enabling the product to be used in a wide range of applications with multiple input/output requirements.

Maximum Seated Height: 4.57 mm

The maximum seated height of 4.57 mm ensures compatibility with various enclosure designs and space constraints, making the product versatile and easy to integrate.

Width: 8.965 mm

The compact width of 8.965 mm saves space on a circuit board and allows for efficient packing of components, ideal for applications with limited board space.

Output Polarity: COMPLEMENTARY

The complementary output polarity simplifies system design and ensures proper signal processing, enhancing the overall performance and reliability of the product.

Peak Reflow Temperature °C: 235

The high peak reflow temperature of 235 °C ensures reliable soldering during assembly, making the product suitable for automated manufacturing processes.

Length: 8.965 mm

The length of 8.965 mm provides a compact footprint, saving space on a circuit board and allowing for efficient placement of components for optimized system design.

Technology: ECL

The ECL (Emitter-Coupled Logic) technology offers high-speed operation and low power consumption, making the product ideal for applications requiring fast and efficient signal processing.

Terminal Form: J BEND

The J bend terminal form facilitates easy and secure soldering during assembly, ensuring reliable electrical connections and enhancing overall product longevity.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm allows for precise and efficient placement on a circuit board, enabling high-density packaging and ensuring reliable electrical connections.

Technical Specifications

Bus Driver & Transceivers MC10192FNR2 attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

10K

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e0

Length:

8.965 mm

Logic IC Type:

No. of Bits:

2

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

235

Propagation Delay (tpd):

4.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.965 mm

Trade Compliance

MC10192FNR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-452-4165, 5962014524165

NIIN

014524165

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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