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MC10H123FNG

Onsemi

MC10H123FNG by Onsemi

MC10H123FNG by Onsemi is a 20-terminal ECL chip carrier with 1.6ns propagation delay, -5.2V power supply, and open-emitter output. Ideal for bus driver & transceiver applications, it operates b/w 0-75 °C and has a peak reflow temperature of 260°C.

Median Price

$7.620

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3,722 parts In-Stock

1+ parts

-

100+ parts

$7.620

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$7.620

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$7.620

3,722

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$7.620

$7.620

$7.620

Flip Electronics (Authorized)

USA . 3,592 parts In-Stock

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3,592

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Distributors (In-Stock)

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Vyrian

USA . 2,460 parts In-Stock

1+ parts

$7.620

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2,460

$7.620

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DigiKey Marketplace

USA . 3,722 parts In-Stock

1+ parts

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100+ parts

$7.613

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3,722

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$7.613

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Flip Electronics

USA . 3,492 parts In-Stock

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Digiode

USA . 364 parts In-Stock

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364

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Bristol Electronics

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Prism Electronics

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Inventory MP

USA . 3 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 3,543 parts In-Stock

1+ parts

$6.480

100+ parts

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3,543

$6.480

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Corohmni

South Africa . 308 parts In-Stock

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$7.613

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308

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Problanco Electronics

Mexico . 8,393 parts In-Stock

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SupplyDigital Components

Austria . 8,138 parts In-Stock

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Component Stockers USA

USA . 2,836 parts In-Stock

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$7.460

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$7.460

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TANS Electronics

Latvia . 2,322 parts In-Stock

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Corphita

USA . 1,822 parts In-Stock

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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Perfect Parts

USA . 1,036 parts In-Stock

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Kulean Microsystems

USA . 1,002 parts In-Stock

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1,002

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UHIMA Technologies

Türkiye . 687 parts In-Stock

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687

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Microchip USA

USA . 125 parts In-Stock

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Overview

Discover the cutting-edge MC10H123FNG by Onsemi, a top-quality bus driver & transceiver that is a game-changer in the industry. With a focus on innovation and excellence, Onsemi delivers unmatched reliability and performance in every product. Ideal for a wide range of applications, this chip carrier package offers lightning-fast propagation delay and open-emitter output characteristics. Experience seamless connectivity and superior functionality with the MC10H123FNG, providing customers with exceptional value, benefits, and advantages that elevate their projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for use in transportation applications.

Propagation Delay At Nominal Supply: 1.7 ns

With a low propagation delay, this bus driver & transceiver ensures fast signal transmission, improving overall system efficiency.

Surface Mount: YES

Being surface mountable allows for easy installation and space-saving on PCBs, making it a convenient choice for compact designs.

No. of Functions: 3

Having multiple functions in one device simplifies circuit design and reduces component count, leading to cost savings and enhanced reliability.

Package Shape: SQUARE

The square package shape offers ease of handling and symmetry in PCB layouts, ensuring optimal space utilization and a neat appearance.

Maximum Operating Temperature: 75 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, making it suitable for a wide range of industrial applications.

Output Characteristics: OPEN-EMITTER WITH CUT-OFF

The open-emitter with cut-off output characteristics provide flexibility in signal routing and control, allowing for versatile use in various signal processing applications.

Technology: ECL

Utilizing ECL technology ensures high-speed performance and low power consumption, making this product suitable for high-performance computing and data communication systems.

Technical Specifications

Bus Driver & Transceivers MC10H123FNG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Additional Features:

WITH 4-3-3 INPUT NOR FUNCTION

Family:

10H

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.965 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Bits:

1

No. of Functions:

3

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER WITH CUT-OFF

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Propagation Delay At Nominal Supply:

1.7 ns

Propagation Delay (tpd):

1.6 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

4.57 mm

Sub-Category:

Gates

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8.965 mm

Trade Compliance

MC10H123FNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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